INCH-POUND
MIL-M-38510/315D
27 October 2003
SUPERSEDING
MIL-M-38510/315C
17 JANUARY 1984
MILITARY SPECIFICATION
MICROCIRCUITS, DIGITAL, LOW-POWER SCHOTTKY TTL,
COUNTERS, MONOLITHIC SILICON
Inactive for new design after 18 April 1997.
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic silicon, low power Schottky TTL,
binary and decade counters. Two product assurance classes and a choice of case outlines/lead finish are provided
for each type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have
been superseded by MIL-PRF-38535, (see 6.3).
1.2 Part or Identifying Number (PIN). The PIN should be in accordance with MIL-PRF-38535, and as specified
herein.
1.2.1 Device types. The device types should be as follows:
Device type
01
02
03
04
05
06
07
08
09
10
11
12
13
Circuit
Decade counter
4-bit binary counter
Synchronous 4-bit decade counter (asynchronous clear)
Synchronous 4-bit binary counter (asynchronous clear)
Synchronous 4-bit up/down decade counter
Synchronous 4-bit up/down binary counter
Synchronous 4-bit up/down decade counter (with clear)
Synchronous 4-bit up/down binary counter (with clear)
Synchronous 4-bit up/down binary counter (with mode control)
Divide-by-twelve counter
Synchronous 4-bit decade counter (with synchronous clear)
Synchronous 4-bit binary counter (with synchronous clear)
Synchronous 4-bit decade counter (with mode control)
1.2.2 Device class. The device class should be the product assurance level as defined in MIL-PRF-38535.
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense
Supply Center Columbus, ATTN: DSCC-VAS, 3990 East Broad St., Columbus, OH 43216-5000, or emailed to
bipolar@dscc.dla.mil. Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at www.dodssp.daps.mil.
AMSC N/A
FSC 5962
MIL-M-38510/315D
1.2.3 Case outlines. The case outlines should be as designated in MIL-STD-1835 and as follows:
Outline letter
A
B
C
D
E
F
2
Descriptive designator
GDFP5-F14 or CDFP6-F14
GDFP4-F14
GDIP1-T14 or CDIP2-T14
GDFP1-F14 or CDFP2-F14
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
CQCC1-N20
Terminals
14
14
14
14
16
16
20
Package style
Flat pack
Flat pack
Dual-in-line
Flat pack
Dual-in-line
Flat pack
Square leadless chip carrier
1.3 Absolute maximum ratings.
Supply voltage range ............................................................................. -0.5 V dc to 7.0 V dc
Input voltage range ................................................................................ -1.2 V dc at -18 mA to 5.5 V dc
Storage temperature range .................................................................... -65° to +150°C
Maximum power dissipation, (P
D
) 1/ :
Device type 05, 06, 07, 08................................................................. 187 mW
Device type 01, 02, 10....................................................................... 83 mW
Device type 03, 04, 11, 12................................................................. 176 mW
Device type 09, 13 ............................................................................ 193 mW
Lead temperature (soldering, 10 seconds) ............................................. 300°C
Thermal resistance, junction to case (θ
JC
):
Cases A, B, C, D, E, F, and 2
(See MIL-STD-1835)
Junction temperature (T
J
) 3/.................................................................... 175°C
1.4 Recommended operating conditions. 2/
Maximum low level output current (I
oL
) ...................................................
Supply voltage (V
CC
) ..............................................................................
Minimum high-level input voltage (V
IH
) ...................................................
Maximum low-level input voltage (V
IL
) ....................................................
Normalized fanout (each output)
Types 01, 02, 05, 06, 07, 08, 10........................................................
Types 03, 04, 09, 11, 12, 13..............................................................
Low-level ......................................................................................
High-level .....................................................................................
Width of input count pulse, t
p
(IN)
Types 01, 02, 10
Input A, reset ................................................................................
Input B ..........................................................................................
Types 07, 08 .....................................................................................
Width of reset pulse, t
p
(reset)
Types 01, 02, 10 ...............................................................................
Count enable time
Type 09, enable ...............................................................................
4.0 mA
4.5 V dc minimum to 5.5 V dc maximum
2.0 V dc
0.7 V dc
10 maximum
10 maximum
20 maximum
15 ns minimum
30 ns minimum
20 ns minimum
25 ns minimum
40 ns minimum
_______
1/ Must withstand the added P
D
due to short-circuit test (e.g., I
OS
).
2/ A change of states on the U/
D
input for device types 09 and 13 is not recommended
when the clock input is low. This may result in an erroneous count.
3/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in
screening conditions in accordance with MIL-PRF-38535.
2
MIL-M-38510/315D
Input clock frequency, f
clock
Types 01, 02, 10
Input A .......................................................................................... 0 to 29 MHz
Types 03, 04, 11, 12 ......................................................................... 0 to 22 MHz
Types 09, 13 ..................................................................................... 0 to 18 MHz
Types 07, 08 ..................................................................................... 0 to 20 MHz
Types 05, 06 ..................................................................................... 0 to 25 MHz
Width of clock pulse, t
w
(clock)
Types 03, 06, 09, 11, 12, 13.............................................................. 25 ns minimum
Types 04 ........................................................................................... 30 ns minimum
Types 05 ........................................................................................... 20 ns minimum
Width of clear pulse, t
w
(clear)
Types 03, 04, 05, 06, 07, 08, 11, 12.................................................. 20 ns minimum
Setup time, t
(setup)
Types 03, 11, 12
Enable P.......................................................................................
Load .............................................................................................
Clear (types 11 and 12 only) ........................................................
Type 04
Enable P.......................................................................................
Load .............................................................................................
Data inputs
Types 03, 09, 11, 12, 13 .........................................................
Type 04 ...................................................................................
Types 07, 08 ........................................................................
Type 05
Data, L inputs ...............................................................................
25 ns minimum
25 ns minimum
20 ns minimum
35 ns minimum
35 ns minimum
20 ns minimum
25 ns minimum
30 ns minimum
15 ns minimum
U/
D
input ..................................................................................... 30 ns minimum
EP, ET inputs ............................................................................... 15 ns minimum
Type 06
Data, L inputs ............................................................................... 25 ns minimum
U/
D
input .....................................................................................
EP, ET, inputs ..............................................................................
Hold time at any input, t
(hold)
Types 09, 13 .....................................................................................
Types 07, 08 .....................................................................................
Types 05, 06
Data, EP, ET inputs ......................................................................
L, U/
D
inputs ...............................................................................
Types 03, 04, 11, 12 .........................................................................
Types 03, 04, 11, 12 t
W
(clear) .........................................................
Case operating temperature range (T
c
)...................................................
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section
does not include documents cited in other sections of this specification or recommended for additional information or as
examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they
must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are
listed.
30 ns minimum
25 ns minimum
0 ns minimum
10 ns minimum
5 ns minimum
0 ns minimum
10 ns minimum
0 ns minimum
-55°C to +125°C
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MIL-M-38510/315D
2.2 Government documents.
2.2.1 Specifications and Standards. The following specifications and standards form a part of this specification to the
extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or
contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 -
Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
MIL-STD-1835
-
-
Test Method Standard for Microelectronics.
Interface Standard Electronic Component Case Outlines
(Copies of these documents are available online at
http://assist.daps.dla.mil;quicksearch/
or
www.dodssp.daps.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein,
the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations
unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract
award (see 4.3 and 6.4).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as specified
herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not
affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535 and herein.
3.3.1 Terminal connections and logic diagrams. The terminal connections and logic diagrams shall be as specified on
figures 1 and 2.
3.3.2 Truth tables. The truth tables and logic equations shall be as specified on figure 3.
3.3.4 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to the
qualifying activity and the preparing activity (DSCC-VAS) upon request.
3.3.5 Case outlines. The case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
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MIL-M-38510/315D
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I, and apply
over the full recommended case operating temperature range, unless otherwise specified.
3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups specified in
table II. The electrical tests for each subgroup are described in table III.
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 12
(see MIL-PRF-38535, appendix A).
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not effect the
form, fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior to
qualification and quality conformance inspection. The following additional criteria shall apply:
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained
under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-
PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical parameters test
prior to burn-in is optional at the discretion of the manufacturer.
c. Additional screening for space level product shall be as specified in MIL-PRF-38535, appendix B.
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Embedded System
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