1:9 Signal Distribution
TEST AND MEASUREMENT PRODUCTS
PRELIMINARY
PRELIMINARY
SK19XX Family
SK19XX Family Product Selection Guide
1:9 Signal Distribution
3 GHz
Logic Family
Pow er
Su p p ly
Op en
Emitter
l
l
l
l
l
Ou tp u t Configu ration
50
Ω
Dou b le
Termination
Internal
Cu rrent Sink
(Dou b le
Termination)
ECL / PECL
Doub le Swing / TTL
ECL / PECL
ECL / PECL
ECL / PECL
N ow
N ow
N ow
N ow
N ow
Ou t p u t
A vailab ility
Synch / Asynch Operation
Prod u ct
3.3V
5.2V
50
Ω
Sou rce
Termination
SK1900
SK1901
SK1902
SK1903
SK1904
l
l
l
l
l
l
l
l
l
Logic / Translation Family
Translation
Prod uct
SK1925
SK1926
SK1927
SK1928
SK1929
SK1930
A nything to PECL
A nything to ECL
A nything to PECL
A nything to ECL
A nything to PECL
A nything to ECL
Op en
Emitter
l
l
l
l
l
l
Outp ut Configuration
50
Ω
Doub le
Termination
50
Ω
Source
Termination
N ow
N ow
N ow
N ow
N ow
N ow
A vailab ility
Open Collector Logic Family
Ou tp u t Con fi gu rati on
Prod u ct
SK1999
Op en Col l ector
l
12mA
N ow
Ou tp u t Cu rren t
A vai l ab i l i ty
Revision 4 / January 30, 2003
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1:9 Signal Distribution
TEST AND MEASUREMENT PRODUCTS
SK19XX Family Package Information (continued)
5mm x 5mm TQFP
9
7
SK19XX Family
b
WITH
PLATING
02
2
R1
e/2
9
9
01
R2
S
GAGE PLANE
03
11
L
00
25
c
c1
(L1)
See Detail in
Figure 2
9
b
b1
Figure 1.
Figure 2.
Figure 3.
All dimensions and tolerancing conforms
to ANSI Y14.5M-1982.
2. The top package body size may be smaller
than the bottom package body size by as
much as 0.15 mm.
3. To be determined at seating plane.
4. Dimensions D1 and E1 do not include
mold protrusion. Allowable protrusion
is 0.25 mm per side. D1 and E1 are
maximum plastic body size dimensions
including mold mismatch.
5. Details of Pin 1 identifier optional, but
must be located within the zone indicated.
6. All dimensions are in millimeters.
7. Dimension b does not include Dambar
protrusion. Allowable Dambar protrusion
shall not cause the lead width to exceed
the maximum b dimension by more than
0.08 mm. Dambar cannot be located
on the lower radius or the foot. Minimum
space between protrusion and an
adjacent lead is 0.07 mm for 0.4 mm and
0.5 mm pitch packages.
8. Exact shape of each corner is optional.
9. These dimensions apply to the flat
section of the lead between 0.10 mm
and 0.25 mm from the lead tip.
10. A1 is defined as the distance from the
seating plane to the lowest point of the
package body.
1.
Sy mb ol
A
A1
A2
D
D1
E
E1
N
e
b
b1
R1
R2
00
01
02
03
S
c
c1
L
L1
aaa
bbb
ccc
ddd
M IN
1.00
0.05
0.95
JEDEC Variation
All Dimensions in Millimeters
N OM
1.10
0.10
1.00
7.00 BSC
5.00 BSC
7.00 BSC
5.00 BSC
32
0.50 BSC
MA X
N ote
Comments
1.20
0.15
1.05
3
4, 2
3
4, 2
Package Bod y Wid th
Lead Count
Lead Pitch
0.27
0.23
0.20
o
Package Stand Off Height
A ir Gap
Package Bod y Thickness
Package Bod y Length
0.17
0.17
0.08
0.08
0
o
o
o
o
0.22
0.20
3.5
12
12
0.60
1.00 REF
0.20
0.20
0.08
0.08
o
o
7
Lead Thickness
7
o
0
13
13
0.20
0.16
0.75
o
o
11
11
0.20
0.09
0.09
0.45
Revision 4 / January 30, 2003
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TEST AND MEASUREMENT PRODUCTS
Absolute Maximum Ratings*
1:9 Signal Distribution
SK19XX Family
Symbol
V
EE
V
CC
V
I
I
OUT
T
stg
T
sol
Parameter
Power Supply (V
CC
= 0V)
Power Supply (V
EE
= 0V)
Input Voltage
Output Current
Continuous
Surge
Storage Temperature
Solder Temperature (<2 to 3 seconds: 245
o
C desired)
Value
- 8.0 to 0
+8.0 to 0
VCC
≥
VI
≥
VEE
50
100
-65 to +150
265
U nit
V
V
V
mA
mA
o
C
o
C
* Maximum Ratings are those values beyond which damage to the device may occur.
Note:
1.
Device is ESD sensitive and requires protective handling.
Revision 4 / January 30, 2003
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