EEWORLDEEWORLDEEWORLD

Part Number

Search

EB52W4D30N-32.768M TR

Description
OSCILLATORS 3.0PPM -30+75 3.3V 4 32.768MHZ CMOS 18.3X21.3MM PCB SMD
CategoryPassive components    oscillator   
File Size120KB,4 Pages
ManufacturerECLIPTEK
Websitehttp://www.ecliptek.com
Download Datasheet Parametric Compare View All

EB52W4D30N-32.768M TR Overview

OSCILLATORS 3.0PPM -30+75 3.3V 4 32.768MHZ CMOS 18.3X21.3MM PCB SMD

EB52W4D30N-32.768M TR Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Reach Compliance Codeunknown

EB52W4D30N-32.768M TR Preview

EB52W4D30N-32.768M
EB52W4 D 30 N -32.768M
Series
3.3Vdc LVCMOS PCB SMD TCXO
Operating Temperature Range
-30°C to +75°C
Frequency Stability
±3.0ppm Maximum
Nominal Frequency
32.768MHz
Control Voltage
None (No Connect on Pin 1)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Stability
Frequency Stability vs. Input Voltage
Aging at 25°C
Frequency Stability vs. Load
Operating Temperature Range
Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Control Voltage
Internal Trim
Modulation Bandwidth
Input Impedance
Phase Noise
Storage Temperature Range
32.768MHz
±3.0ppm Maximum (Inclusive of Operating Temperature Range)
±0.3ppm Maximum (±5%)
±1ppm/Year Maximum
±0.2ppm Maximum (±2pF)
-30°C to +75°C
3.3Vdc ±5%
35mA Maximum
90% of Vdd Minimum
10% of Vdd Maximum
10nSec Maximum (Measured at 20% to 80% of waveform)
50% ±10% (Measured at 50% of waveform)
15pF Maximum
CMOS
None (No Connect on Pin 1)
±3ppm Minimum (Top of Can)
10kHz Minimum (Measured at -3dB with a Control Voltage of 1.65Vdc)
10kOhms Typical
-70dBc at 10Hz Offset, -100dBc at 100Hz Offset, -130dBc at 1kHz Offset, -140dBc at 10kHz Offset, -
145dBc at 100kHz Offset (Typical Values Fo=19.200MHz at 25°C at Nominal Vdd and Vc)
-40°C to +85°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
Gross Leak Test
Lead Integrity
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 1014 Condition A (Internal Crystal Only)
MIL-STD-883, Method 1014 Condition C (Internal Crystal Only)
MIL-STD-883, Method 2004
MIL-STD-202, Method 213 Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007 Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 1 of 4
EB52W4D30N-32.768M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
1
2
3
4
CONNECTION
No Connect
Ground
Output
Supply Voltage
1.5
±0.3
DIA 3.5 ±0.5
4.5
±0.3
4.0 ±0.3
1.7
±0.4
4
7.62
±0.30
3
11.7
±0.5
4.0 ±0.3
2
1.0
±0.1
18.3 ±0.5
21.3 ±0.5
LINE MARKING
1
2
3
ECLIPTEK
32.768M
M=MHz
XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
1
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.6 (X4)
3.5 (X4)
14.8
Solder Land
(X4)
5.9
All Tolerances are ±0.1
OUTPUT WAVEFORM
CLOCK OUTPUT
V
OH
80% of Waveform
50% of Waveform
20% of Waveform
V
OL
Fall
Time
Rise
Time
T
W
T
Duty Cycle (%) = T
W
/T x 100
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 2 of 4
EB52W4D30N-32.768M
Test Circuit for CMOS Output
Oscilloscope
Frequency
Counter
+
+
Power
Supply
_
+
Voltage
Meter
_
Current
Meter
_
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
0.01µF
(Note 1)
0.1µF
(Note 1)
Ground
C
L
(Note 3)
No Connect
or Tri-State
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and V
DD
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 3 of 4
EB52W4D30N-32.768M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 240°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 4 of 4

EB52W4D30N-32.768M TR Related Products

EB52W4D30N-32.768M TR EB52W4D30N-32.768M
Description OSCILLATORS 3.0PPM -30+75 3.3V 4 32.768MHZ CMOS 18.3X21.3MM PCB SMD OSCILLATORS 3.0PPM -30+75 3.3V 4 32.768MHZ CMOS 18.3X21.3MM PCB SMD
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Reach Compliance Code unknown unknown
Error when compiling the msp430 program
When compiling a program for msp430, the error message Error[e46]: Undefinedexternal "main" referred in?cstart(D:\ProgramFiles\iar\430\LIB\CLIB\cl430f.r43) always appears. How can I solve this? I thin...
liwenbiao Microcontroller MCU
Talking about the reliability of embedded systems (Part 2)
[b][color=#000000][font=Arial][font=Arial][size=5]1.[/size][/font] [/font][font=新宋体][size=5]Simple scheduler improves operating system reliability[/size][/font][/color][/b][align=left][color=#000000]W...
djyos Embedded System
How can IC products ensure that they comply with RoHS requirements?
A: As a quality assurance for any product, process assurance is always the fundamental method. Therefore, for IC products, we also start from the source and require that the raw materials used meet th...
yihuang FPGA/CPLD
How to define dozens of mobile power banks in a string?
[font=宋体][size=6][color=red]I still don't understand:puzzle:how does the mobile power protection board determine the number of "strings", is it the number of battery cells:puzzle:or something else? Pl...
乐邦 Talking
[M4 floating point] How to explain "32-bit instruction set, with single-precision data operation capability"?
"32-bit instruction set, with single-precision data operation capability" What does this sentence mean exactly?...
Study_Stellaris Microcontroller MCU
Xilinx spartan3E replaces ARM A8 for fun
I have several Xilinx original FPGAStarter Kit Boards and want to try out an ARM A8....
yingjue Buy&Sell

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2684  1708  282  1439  2275  55  35  6  29  46 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号