IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, SOIC-16, Multiplexer or Switch
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Vishay |
| Parts packaging code | SOIC |
| package instruction | SOP, |
| Contacts | 16 |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | SPST |
| JESD-30 code | R-PDSO-G16 |
| JESD-609 code | e0 |
| length | 9.9 mm |
| Nominal Negative Supply Voltage (Vsup) | |
| Number of channels | 1 |
| Number of functions | 4 |
| Number of terminals | 16 |
| Nominal off-state isolation | 69 dB |
| On-state resistance matching specifications | 2.2 Ω |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 240 |
| Certification status | Not Qualified |
| Maximum seat height | 1.75 mm |
| Maximum supply current (Isup) | 6 mA |
| Nominal supply voltage (Vsup) | 12 V |
| surface mount | YES |
| Maximum disconnect time | 30 ns |
| Maximum connection time | 45 ns |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 3.9 mm |
| DG601DY-T1 | 5962-9089101M2X | 5962-9089101MEX | 5962-9089101MEA | |
|---|---|---|---|---|
| Description | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, SOIC-16, Multiplexer or Switch | SPST, 4 Func, 1 Channel, CMOS, CQCC20, CERAMIC, LCC-20 | SPST, 4 Func, 1 Channel, CMOS, CDIP16, CERAMIC, DIP-16 | SPST, 4 Func, CMOS, CDIP16 |
| Parts packaging code | SOIC | QLCC | DIP | DIP |
| Contacts | 16 | 20 | 16 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Analog Integrated Circuits - Other Types | SPST | SPST | SPST | SPST |
| JESD-30 code | R-PDSO-G16 | S-CQCC-N20 | R-GDIP-T16 | R-XDIP-T16 |
| Number of functions | 4 | 4 | 4 | 4 |
| Number of terminals | 16 | 20 | 16 | 16 |
| Maximum operating temperature | 85 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -40 °C | -55 °C | -55 °C | -55 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC |
| encapsulated code | SOP | QCCN | DIP | DIP |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | CHIP CARRIER | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | YES | NO | NO |
| Maximum connection time | 45 ns | 45 ns | 45 ns | 45 ns |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
| Terminal form | GULL WING | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | DUAL | QUAD | DUAL | DUAL |
| Maker | Vishay | - | Vishay | Vishay |
| package instruction | SOP, | QCCN, | DIP, | - |
| JESD-609 code | e0 | e0 | - | e0 |
| Number of channels | 1 | 1 | 1 | - |
| Nominal supply voltage (Vsup) | 12 V | 12 V | 12 V | - |
| Maximum disconnect time | 30 ns | 30 ns | 30 ns | - |
| Terminal surface | TIN LEAD | TIN LEAD | - | Tin/Lead (Sn/Pb) - hot dipped |
| Maximum on-state resistance (Ron) | - | 35 Ω | 35 Ω | 140 Ω |