NIN-HK120ATRF datasheet, PDF - EEWORLD Datasheet

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NIN-HK120ATRF: DescriptionGeneral Purpose Inductor, 0.012uH, 3%, 1 Element, SMD, CHIP; CategoryPassive components inductor; File Size108KB，5 Pages; ManufacturerNichicon; Websitehttp://www.nichicon.co.jp; Environmental Compliance

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NIN-HK120ATRF Overview

General Purpose Inductor, 0.012uH, 3%, 1 Element, SMD, CHIP

NIN-HK120ATRF Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Nichicon
Reach Compliance Code	unknown
ECCN code	EAR99
DC Resistance	0.14 Ω
Nominal inductance(L)	0.012 µH
Inductor Applications	RF INDUCTOR
Inductor type	GENERAL PURPOSE INDUCTOR
JESD-609 code	e3
Number of functions	1
Number of terminals	2
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Minimum quality factor (at nominal inductance)	30
Maximum rated current	0.64 A
self resonant frequency	5500 MHz
Shape/Size Description	RECTANGULAR PACKAGE
shield	NO
surface mount	YES
Terminal surface	Tin (Sn) - with Nickel (Ni) barrier
Terminal location	DUAL ENDED
Terminal shape	WRAPAROUND
Test frequency	250 MHz
Tolerance	3%

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Wirewound Chip Inductors

FEATURES

•

SIZES K (0402), J (0603), D (0805) AND C (1008)

EXCELLENT HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS

BOTH FLOW AND REFLOW SOLDERING APPLICABLE*

HIGH INDUCTANCE AVAILABLE IN SMALL SIZE

EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

NIN-H Series

*FLOW & REFLOW SOLDERING 0805 & 1008 SIZES, 0402 & 0603 REFLOW SOLDERING ONLY

Size (Case Code)

Specifications

Inductance Range

Inductance Tolerance

Operating Temperature Range

Q-Factor, Self Resonant Frequency

DC Resistance, Rated DC Current

and Inductance Tolerance

0402 (K)

6.8nH ~ 56nH

0603 (J)

3.3nH ~ 220nH

0805 (D)

3.3nH ~ 820nH

1008 (C)

10nH ~ 4.7

µH

SURFACE MOUNT

±5% (J), ±3% (A), ±2% (G),

±0.5nH (E), ±0.2nH (Z)

-40°C ~ +85°C

±20% (M), ±10% (K), ±5% (J), ±2% (G)

-40°C ~ +125°C

See Individual Product Listings

ENVIRONMENTAL CHARACTERISTICS

Test

Solderability

Humidity

Soldering Effect

Low Frequency Vibration

Thermal Shock

Low Temperature Storage

(1) No Evidence of

Damage

(2) Inductance Shall Be

Within ±10% of Initial

Value (±20% for 0402

& 0603 case sizes)

(3) Q Factor Shall Be

Within ±10% of Initial

Value (±20% for 0402

& 0603 case sizes)

(1) No Evidence of

Damage

(2) Inductance Shall Be

Within +5% of initial

Value

(3) Q Factor Shall Be

Within +10 of initial

Value (±20% for 0402

& 603 case sizes)

Specification

75% Min. Coverage

Test Method & Condition

After 3 Sec. Dip in +230

C Solder Pot (Post Flux)

After 500 Hrs at 60

C and 90 ~ 95% RH

After 5 Seconds at +260

C (after pre-conditioning)

After 2 Hrs per Axis, 10 ~ 55Hz, 1.5 mm Amplitude

After 100 cycles over rated temp. range (30 min. each)

After 500 Hrs at -40

High Temperature Load Life

After 500 Hrs at max. rated temperature with rated DC Current

Humidity Load Life

After 500 Hrs at 60

C with 90 ~ 95% RH

with Rated DC Current

NIN-H K 6N8 J TR F

Lead Free (100% Sn optional)

Taped & Reeled

Tolerance Code

(Z ±0.2nH, E ±0.5nH, G ±2%, A ±3%, J ±5%)

Inductance Value in Nanohenries

(see standard values table for correct

value code)

Case Code (K = 0402, J = 0603, D = 0805, C = 1008)

Series

www.niccomp.com

www.lowESR.com

www.RFpassives.com

231

NIC COMPONENTS

REV 99-11(1)

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