Synchronous DRAM, 2MX8, 9ns, CMOS, PDSO44, 0.400 INCH, 0.80 MM PITCH, TSOP2-44
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | SK Hynix |
| Parts packaging code | TSOP2 |
| package instruction | TSOP2, TSOP44,.46,32 |
| Contacts | 44 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| access mode | DUAL BANK PAGE BURST |
| Maximum access time | 9 ns |
| Other features | AUTO/SELF REFRESH |
| Maximum clock frequency (fCLK) | 76 MHz |
| I/O type | COMMON |
| interleaved burst length | 1,2,4,8 |
| JESD-30 code | R-PDSO-G44 |
| JESD-609 code | e0 |
| length | 18.41 mm |
| memory density | 16777216 bit |
| Memory IC Type | SYNCHRONOUS DRAM |
| memory width | 8 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 44 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 2MX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSOP2 |
| Encapsulate equivalent code | TSOP44,.46,32 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| refresh cycle | 4096 |
| Maximum seat height | 1.2 mm |
| self refresh | YES |
| Continuous burst length | 1,2,4,8,FP |
| Maximum standby current | 0.002 A |
| Maximum slew rate | 0.1 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 10.16 mm |
| HY57V16801TC-13 | HY57V16801TC-8 | HY57V16801TC-10 | |
|---|---|---|---|
| Description | Synchronous DRAM, 2MX8, 9ns, CMOS, PDSO44, 0.400 INCH, 0.80 MM PITCH, TSOP2-44 | Synchronous DRAM, 2MX8, 6ns, CMOS, PDSO44, 0.400 INCH, 0.80 MM PITCH, TSOP2-44 | Synchronous DRAM, 2MX8, 7ns, CMOS, PDSO44, 0.400 INCH, 0.80 MM PITCH, TSOP2-44 |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | SK Hynix | SK Hynix | SK Hynix |
| Parts packaging code | TSOP2 | TSOP2 | TSOP2 |
| package instruction | TSOP2, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 |
| Contacts | 44 | 44 | 44 |
| Reach Compliance Code | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 |
| access mode | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST |
| Maximum access time | 9 ns | 6 ns | 7 ns |
| Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| Maximum clock frequency (fCLK) | 76 MHz | 125 MHz | 100 MHz |
| I/O type | COMMON | COMMON | COMMON |
| interleaved burst length | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 |
| JESD-30 code | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 |
| JESD-609 code | e0 | e0 | e0 |
| length | 18.41 mm | 18.41 mm | 18.41 mm |
| memory density | 16777216 bit | 16777216 bit | 16777216 bit |
| Memory IC Type | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
| memory width | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 |
| Number of terminals | 44 | 44 | 44 |
| word count | 2097152 words | 2097152 words | 2097152 words |
| character code | 2000000 | 2000000 | 2000000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| organize | 2MX8 | 2MX8 | 2MX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSOP2 | TSOP2 | TSOP2 |
| Encapsulate equivalent code | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 3.3 V | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 4096 | 4096 | 4096 |
| Maximum seat height | 1.2 mm | 1.2 mm | 1.2 mm |
| self refresh | YES | YES | YES |
| Continuous burst length | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP |
| Maximum standby current | 0.002 A | 0.002 A | 0.002 A |
| Maximum slew rate | 0.1 mA | 0.15 mA | 0.12 mA |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 10.16 mm | 10.16 mm | 10.16 mm |
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