Telephone Circuit, Bipolar, PDSO20,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | SOP, SOP20,.4 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDSO-G20 |
| JESD-609 code | e0 |
| Number of terminals | 20 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -25 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP20,.4 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| power supply | 3.7/7 V |
| Certification status | Not Qualified |
| Maximum slew rate | 1.6 mA |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| TEA1064ATD-T | TEA1064AN | TEA1064ATD | TEA1064BTD-T | |
|---|---|---|---|---|
| Description | Telephone Circuit, Bipolar, PDSO20, | Telephone Circuit, Bipolar, PDIP20, | Telephone Circuit, Bipolar, PDSO20, | Telephone Circuit, Bipolar, PDSO20, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | SOP, SOP20,.4 | DIP, DIP20,.3 | SOP, SOP20,.4 | SOP, SOP20,.4 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Number of terminals | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| Minimum operating temperature | -25 °C | -25 °C | -25 °C | -25 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | DIP | SOP | SOP |
| Encapsulate equivalent code | SOP20,.4 | DIP20,.3 | SOP20,.4 | SOP20,.4 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| power supply | 3.7/7 V | 3.7/7 V | 3.7/7 V | 2.7 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 1.6 mA | 1.6 mA | 1.6 mA | 1.6 mA |
| surface mount | YES | NO | YES | YES |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | OTHER | OTHER | OTHER | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
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