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TZA3040HL

Description
Telecom Circuit, Bipolar, PQFP32,
CategoryWireless rf/communication    Telecom circuit   
File Size1MB,54 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric View All

TZA3040HL Overview

Telecom Circuit, Bipolar, PQFP32,

TZA3040HL Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionQFP, QFP32,.28SQ,20
Reach Compliance Codeunknown
JESD-30 codeS-PQFP-G32
JESD-609 codee0
Number of terminals32
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Encapsulate equivalent codeQFP32,.28SQ,20
Package shapeSQUARE
Package formFLATPACK
power supply5 V
Certification statusNot Qualified
Nominal supply voltage5 V
surface mountYES
technologyBIPOLAR
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD

TZA3040HL Preview

APPLICATION NOTE
Fiber optic transceiver board
STM1/4/8, OC3,12,24, FC/GE
AN98090
Philips Semiconductors
Fiber optic transceiver board STM1/4/8,
OC3,12,24, FC/GE
Application Note
AN98090
Abstract
This application note describes demoboard OM5802. This demoboard is designed for customer demonstration of
Philips Semiconductors’ TZA30xx series ICs. The functionality which can be demonstrated are: full receiver
(TZA3030, TZA3000, TZA3040), Data and clock recovery (TZA3004), Transceiver (demultiplexer, frame detect &
alignment, multiplexer and clock convertor, TZA3005) and Laserdriver (TZA3031, TZA3001, TZA3041). Since
the pinout of the ICs is identical for 155, 622, 1062.5 and 1250 Mbps, the board can be used for all these
datarates. Only the appropriate ICs must be chosen for the datarate.
The application note is limited to information not described in the individual datasheets.
Apart from a sample application of the ICs, a cleanup PLL, acting as reference generator in Add/Drop
Multiplexers has been added to the board.
©
Philips Electronics N.V. 1998
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copy-
right owner.
The information presented in this document does not form part of any quotation or contract, is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent- or other indus-
trial or intellectual property rights.
2
Philips Semiconductors
Fiber optic transceiver board STM1/4/8,
OC3,12,24, FC/GE
Application Note
AN98090
APPLICATION NOTE
Fiber optic transceiver board
STM1/4/8, OC3,12,24, FC/GE
AN98090
Author:
Marcel J.M. Geurts
Philips Semiconductors Systems Laboratory Eindhoven,
The Netherlands.
Keywords
Telecom
Optical networks
SDH
SONET
STM1, STM4, Fiber Channel, Gigabit Ethernet
OC3, OC12, OC24
CML,PECL
1 chip receiver
High transimpedance overload
Laser output control
Number of pages: 55
Date: 28 september 1998
3
Philips Semiconductors
Fiber optic transceiver board STM1/4/8,
OC3,12,24, FC/GE
Introduction
This application note is written to support the following ICs:
TABLE 1 Supported ICs for demoboard OM5802
Functionality
Datarate 1 chip
Data & Clock Aligned Mux/Demux,
[Mbps] receiver
recovery unit Clock converter
155
TZA3030 TZA3004
TZA3005
622
TZA3000 TZA3004
TZA3005
1063
1250
TZA3040
TZA3040
OQ2541
OQ2541
Application Note
AN98090
Laserdriver
TZA3031
TZA3001
TZA3041
TZA3041
The apnote consists of the following sections:
Getting started: containing block diagram, connection setup and test description.
General section: acronyms, layout consideration and cross section of the PCB.
User interface: description of the functionality of buses, pin arrays, LEDs and switches on the board.
Schematics: the complete schematic diagram of the board.
Layouts: an enlarged view of the layers of the board.
Bill of materials: the component mounted on the board.
No detailed description of the blocks and measurements are available on this moment. They will be described in
a document which will be available in October 1998.
This document has been adapted from the AN97065 which described the previous board release (PR47512).
The board revision described in this document is PR47513.
4
Philips Semiconductors
Fiber optic transceiver board STM1/4/8,
OC3,12,24, FC/GE
TABLE OF CONTENTS:
1.
Application Note
AN98090
Getting started:
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2
Demoboard description . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3
Test possibilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3.1
1 chip receiver TZA3000 . . . . . . . . . . . . . . . . . . . . .
1.3.2
Data and clock recovery unit TZA3004 . . . . . . . . . . . . . .
1.3.3
Mux/Demux TZA3005 . . . . . . . . . . . . . . . . . . . . . . .
1.3.4
Laserdriver TZA3001 . . . . . . . . . . . . . . . . . . . . . . .
1.4
How to test & what to set . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4.2
Mounting of the photodetector . . . . . . . . . . . . . . . . . .
1.4.3
Mounting of the laserdiode . . . . . . . . . . . . . . . . . . . .
1.4.4
Supply voltages . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4.5
Back to back sensitivity measurement: Laserdriver in - DCR out .
1.4.6
Sensitivity on 1 chip receiver TZA3000 . . . . . . . . . . . . . .
1.4.7
Laserdriver output waveforms. . . . . . . . . . . . . . . . . . .
1.5
Switches setting overview for 622 Mbps mode . . . . . . . . . . . . . . . .
1.6
Results: BER and Laser output waveform . . . . . . . . . . . . . . . . . .
GENERAL
. . . . . . . . . .
2.1
Acronyms . . . . . . .
2.2
Layout considerations
2.3
Optical components .
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25
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29
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35
2.
3.
User Interface
. . . . . . . . . . . . . .
3.1
SMA, SMB connectors and Arrays
3.2
Dipswitches & LEDs . . . . . . .
3.3
Supply voltage selectors . . . . .
4.
Schematics.
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2
1 chip receiver TZA30x0: PD_TIA . . . . . . . . . . . . . . . . . . . . . . . . .
4.3
Data and Clock recovery device TZA3004: DCR . . . . . . . . . . . . . . . . . .
4.4
Data and Clock recovery device OQ2541: DCR (in 1250 Mbps configuration only)
4.5
Mux & demux: TZA3005: DMUX_FD_MUX_CC . . . . . . . . . . . . . . . . . .
4.6
Laserdriver TZA30x1: LDR_LD . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.7
Reference PLL for loopback signal cleanup . . . . . . . . . . . . . . . . . . . .
5.
6.
Bill of materials
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Layouts.
. . . . . . . . . . . . . . . . . . . . . . . . .
6.1
Silkscreen. . . . . . . . . . . . . . . . . . . . .
6.2
Top layer component placement . . . . . . . . .
6.3
Toplayer copper . . . . . . . . . . . . . . . . .
6.4
First inner layer (#3) copper, inverted . . . . . .
6.5
Second inner layer (#4) copper, topview . . . . .
6.6
Bottom layer (#2) copper topview. . . . . . . . .
6.7
Bottom compenent placement (view from bottom)
5
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