MK10X256VMD100R datasheet, PDF

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MK10X256VMD100R: DescriptionFLASH, 100 MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，59 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MK10X256VMD100R Overview

FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144

MK10X256VMD100R Parametric

Parameter Name	Attribute value
Maker	NXP
Parts packaging code	BGA
package instruction	LBGA, BGA144,12X12,40
Contacts	144
Reach Compliance Code	unknown
ECCN code	3A001.A.3
Has ADC	YES
Address bus width
bit size	32
maximum clock frequency	50 MHz
DAC channel	YES
DMA channel	YES
External data bus width
JESD-30 code	S-PBGA-B144
length	13 mm
Number of I/O lines	104
Number of terminals	144
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA144,12X12,40
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE
power supply	1.8/3.3 V
Certification status	Not Qualified
RAM (bytes)	65536
rom(word)	262144
ROM programmability	FLASH
Maximum seat height	1.7 mm
speed	100 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	1.71 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	13 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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Freescale Semiconductor

Data Sheet: Product Preview

Document Number: K10P144M100SF2

Rev. 2, 3/2011

Supports the following:

MK10X128VLQ100,

MK10X128VMD100,

MK10X256VLQ100,

MK10X256VMD100,

MK10N512VLQ100,

MK10N512VMD100

K10 Sub-Family Product

Preview

K10P144M100SF2

Features

• Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 100 MHz ARM Cortex-M4 core with DSP

instructions delivering 1.25 Dhrystone MIPS per

MHz

• Memories and memory interfaces

– Up to 512 KB program flash memory on non-

FlexMemory devices

– Up to 256 KB program flash memory on

FlexMemory devices

– Up to 256 KB FlexNVM on FlexMemory devices

– 4 KB FlexRAM on FlexMemory devices

– Up to 128 KB RAM

– Serial programming interface (EzPort)

– FlexBus external bus interface

• Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

• System peripherals

– 10 low-power modes to provide power optimization

based on application requirements

– Memory protection unit with multi-master

protection

– 16-channel DMA controller, supporting up to 64

request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit

• Security and integrity modules

– Hardware CRC module to support fast cyclic

redundancy checks

– 128-bit unique identification (ID) number per chip

• Human-machine interface

– Low-power hardware touch sensor interface (TSI)

– General-purpose input/output

• Analog modules

– Two 16-bit SAR ADCs

– Programmable gain amplifier (up to x64) integrated

into each ADC

– Two 12-bit DACs

– Three analog comparators (CMP) containing a 6-bit

DAC and programmable reference input

– Voltage reference

This document contains information on a product under development. Freescale

reserves the right to change or discontinue this product without notice.

Preliminary

Table of Contents

1 Ordering parts...........................................................................4

1.1 Determining valid orderable parts......................................4

2 Part identification......................................................................4

2.1 Description.........................................................................4

2.2 Format...............................................................................4

2.3 Fields.................................................................................4

2.4 Example............................................................................5

3 Terminology and guidelines......................................................5

3.1 Definition: Operating requirement......................................5

3.2 Definition: Operating behavior...........................................6

3.3 Definition: Attribute............................................................6

3.4 Definition: Rating...............................................................7

3.5 Result of exceeding a rating..............................................7

3.6 Relationship between ratings and operating

requirements......................................................................7

3.7 Guidelines for ratings and operating requirements............8

3.8 Definition: Typical value.....................................................8

3.9 Typical Value Conditions...................................................9

4 Ratings......................................................................................9

4.1 Thermal handling ratings...................................................10

4.2 Moisture handling ratings..................................................10

4.3 ESD handling ratings.........................................................10

4.4 Voltage and current operating ratings...............................10

5 General.....................................................................................11

5.1 Nonswitching electrical specifications...............................11

5.1.1

5.1.2

5.1.3

5.1.4

5.1.5

5.1.6

5.1.7

5.1.8

Voltage and Current Operating Requirements......11

LVD and POR operating requirements.................12

Voltage and current operating behaviors..............12

Power mode transition operating behaviors..........13

Power consumption operating behaviors..............14

EMC radiated emissions operating behaviors.......17

Designing with radiated emissions in mind...........18

Capacitance attributes..........................................18

6.8.4

6.8.5

6.8.6

6.8.7

6.8.3

5.3.1

5.3.2

Thermal operating requirements...........................19

Thermal attributes.................................................20

6 Peripheral operating requirements and behaviors....................20

6.1 Core modules....................................................................20

6.1.1

6.1.2

Debug trace timing specifications.........................20

JTAG electricals....................................................21

6.2 System modules................................................................23

6.3 Clock modules...................................................................23

6.3.1

6.3.2

Oscillator Electrical Characteristics.......................23

32kHz Oscillator Electrical Characteristics............26

6.4 Memories and memory interfaces.....................................26

6.4.1

6.4.2

EzPort Switching Specifications............................26

Flexbus Switching Specifications..........................27

6.5 Security and integrity modules..........................................30

6.6 Analog...............................................................................30

6.6.1

6.6.2

6.6.3

ADC electrical specifications.................................30

12-bit DAC electrical characteristics.....................38

Voltage Reference Electrical Specifications..........41

6.7 Timers................................................................................42

6.8 Communication interfaces.................................................42

6.8.1

6.8.2

CAN.......................................................................43

DSPI Switching Specifications for Low-speed

Operation..............................................................43

DSPI Switching Specifications (High-speed

mode)....................................................................44

I2C.........................................................................46

UART....................................................................46

SDHC Specifications.............................................46

I2S Switching Specifications.................................47

6.9 Human-machine interfaces (HMI)......................................49

7 Dimensions...............................................................................49

7.1 Obtaining package dimensions.........................................49

8 Pinout........................................................................................49

8.1 K10 Signal Multiplexing and Pin Assignments..................50

8.2 K10 Pinouts.......................................................................56

9 Revision History........................................................................58

5.2 Switching specifications.....................................................18

5.2.1

5.2.2

Device clock specifications...................................18

General Switching Specifications..........................19

5.3 Thermal specifications.......................................................19

K10 Sub-Family Product Preview Data Sheet, Rev. 2, 3/2011.

Freescale Semiconductor, Inc.

Preliminary

MK10X256VMD100R Related Products

	MK10X256VMD100R	MK10X128VMD100	MK10X128VMD100R	MK10X256VMD100	MK10N512VMD100	MK10N512VMD100R
Description	FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144	FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144	FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144	FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144	FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144	FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	LBGA, BGA144,12X12,40	LBGA, BGA144,12X12,40	LBGA, BGA144,12X12,40	13 X 13 MM, MAPBGA-144	13 X 13 MM, MAPBGA-144	LBGA, BGA144,12X12,40
Contacts	144	144	144	144	144	144
Reach Compliance Code	unknown	unknown	unknown	compliant	compliant	unknown
ECCN code	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
Has ADC	YES	YES	YES	YES	YES	YES
bit size	32	32	32	32	32	32
maximum clock frequency	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz
DAC channel	YES	YES	YES	YES	YES	YES
DMA channel	YES	YES	YES	YES	YES	YES
JESD-30 code	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144
length	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm
Number of I/O lines	104	104	104	104	104	104
Number of terminals	144	144	144	144	144	144
Maximum operating temperature	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA
Encapsulate equivalent code	BGA144,12X12,40	BGA144,12X12,40	BGA144,12X12,40	BGA144,12X12,40	BGA144,12X12,40	BGA144,12X12,40
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
power supply	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	65536	32768	32768	65536	131072	131072
rom(word)	262144	131072	131072	262144	524288	524288
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	1.7 mm	1.7 mm	1.7 mm	1.7 mm	1.7 mm	1.7 mm
speed	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Maker	NXP	-	NXP	NXP	NXP	NXP

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