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HY62QF8100CLLF-I-10

Description
Standard SRAM, 128KX8, 100ns, CMOS, PBGA48, FINE PITCH, BGA-48
Categorystorage    storage   
File Size155KB,9 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric View All

HY62QF8100CLLF-I-10 Overview

Standard SRAM, 128KX8, 100ns, CMOS, PBGA48, FINE PITCH, BGA-48

HY62QF8100CLLF-I-10 Parametric

Parameter NameAttribute value
MakerSK Hynix
Parts packaging codeBGA
package instructionTFBGA,
Contacts48
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time100 ns
JESD-30 codeR-PBGA-B48
JESD-609 codee1
length6.3 mm
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals48
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX8
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch0.75 mm
Terminal locationBOTTOM
width6.2 mm
HY62QF8100C Series
128Kx8bit full CMOS SRAM
DESCRIPTION
The HY62QF8100C is a high speed, super low
power and 1M bit full CMOS SRAM organized as
131,072 words by 8bit. The HY62QF8100C uses
high performance full CMOS process technology
and designed for high speed low power circuit
technology. It is particularly well suited for used in
high density low power system application. This
device has a data retention mode that guarantees
data to remain valid at a minimum power supply
voltage of 1.2V.
FEATURES
Fully static operation and Tri-state output
TTL compatible inputs and outputs
Battery backup(LL/SL-part)
- 1.2V(min) data retention
Standard pin configuration
-. 48 - FBGA
-. 32 - sTSOPI - 8X13.4(Standard)
Product
Voltage
Speed
No.
(V)
(ns)
HY62QF8100C
2.3~2.7 70/85/100
HY62QF8100C-I
2.3~2.7 70/85/100
Note 1. Blank : Commercial, I : Industrial
2. Current value is max.
Operation
Current/Icc(mA)
3
3
Standby Current(uA)
LL
SL
3
1
3
1
Temperature
°C
0~70
-40~85(I)
PIN CONNECTION
A0
A1
CS2 A3
/WE A4
NC
A5
A6
A7
A8
IO1
IO2
Vcc
Vss
NC
NC
IO3
A11
A9
A8
A13
/WE
CS2
A15
Vcc
NC
A16
A14
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
/OE
A10
/CS1
DQ8
DQ7
DQ6
DQ5
DQ4
Vss
DQ3
DQ2
DQ1
A0
A16
A1
A2
A3
/CS1
CS2
A0
BLOCK DIAGRAM
ROW
DECODER
SENSE AMP
I/O1
IO5 A2
IO6
Vss
Vcc
IO7
ADD INPUT
BUFFER
BUFFER
COLUMN
DECODER
MEMORY ARRAY
128K x 8
WRITE DRIVER
IO8 /OE /CS1 A16 A15 IO4
A9
A10 A11 A12 A13 A14
I/O8
CONTROL
LOGIC
FBGA
sTSOP l
/OE
/WE
PIN DESCRIPTION
Pin Name
/CS1
CS2
/WE
/OE
Pin Function
Chip Select 1
Chip Select 2
Write Enable
Output Enable
Pin Name
A0 ~ A16
I/O1 ~ I/O8
Vcc
Vss
Pin Function
Address Inputs
Data Inputs / Outputs
Power( 2.3V~2.7V)
Ground
This document is a general product description and is subject to change without notice. Hyundai Electronics does not assume any
responsibility for use of circuits described. No patent licenses are implied.
Rev.02 /Jun. 00
Hyundai Semiconductor

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