|
TL082MDC |
TL082MWC |
| Description |
IC DUAL OP-AMP, 20000 uV OFFSET-MAX, 4 MHz BAND WIDTH, UUC, DIE, Operational Amplifier |
IC DUAL OP-AMP, 20000 uV OFFSET-MAX, 4 MHz BAND WIDTH, UUC, WAFER, Operational Amplifier |
| Maker |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
| Parts packaging code |
WAFER |
WAFER |
| package instruction |
DIE, DIE OR CHIP |
, WAFER |
| Reach Compliance Code |
unknown |
unknown |
| ECCN code |
EAR99 |
EAR99 |
| Amplifier type |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
| Architecture |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) |
0.0004 µA |
0.0004 µA |
| Maximum bias current (IIB) at 25C |
0.0004 µA |
0.0004 µA |
| Nominal Common Mode Rejection Ratio |
100 dB |
100 dB |
| frequency compensation |
YES |
YES |
| Maximum input offset current (IIO) |
0.004 µA |
0.004 µA |
| Maximum input offset voltage |
20000 µV |
20000 µV |
| JESD-30 code |
X-XUUC-N |
X-XUUC-N |
| low-bias |
YES |
YES |
| low-dissonance |
NO |
NO |
| Negative supply voltage upper limit |
-18 V |
-18 V |
| Nominal Negative Supply Voltage (Vsup) |
-15 V |
-15 V |
| Number of functions |
2 |
2 |
| Maximum operating temperature |
70 °C |
70 °C |
| Package body material |
UNSPECIFIED |
UNSPECIFIED |
| Encapsulate equivalent code |
DIE OR CHIP |
WAFER |
| Package shape |
UNSPECIFIED |
UNSPECIFIED |
| Package form |
UNCASED CHIP |
UNCASED CHIP |
| power supply |
+-15 V |
+-15 V |
| Certification status |
Not Qualified |
Not Qualified |
| minimum slew rate |
8 V/us |
8 V/us |
| Nominal slew rate |
13 V/us |
13 V/us |
| Maximum slew rate |
5.6 mA |
5.6 mA |
| Supply voltage upper limit |
18 V |
18 V |
| Nominal supply voltage (Vsup) |
15 V |
15 V |
| surface mount |
YES |
YES |
| technology |
BIPOLAR |
BIPOLAR |
| Temperature level |
COMMERCIAL |
COMMERCIAL |
| Terminal form |
NO LEAD |
NO LEAD |
| Terminal location |
UPPER |
UPPER |
| Nominal Uniform Gain Bandwidth |
4000 kHz |
4000 kHz |
| Minimum voltage gain |
15000 |
15000 |