Fast Page DRAM Module, 4MX32, 80ns, CMOS, PSMA72,
| Parameter Name | Attribute value |
| Maker | LAPIS Semiconductor Co., Ltd. |
| package instruction | SIMM, SSIM72 |
| Reach Compliance Code | unknown |
| Maximum access time | 80 ns |
| I/O type | COMMON |
| JESD-30 code | R-PSMA-N72 |
| memory density | 134217728 bit |
| Memory IC Type | FAST PAGE DRAM MODULE |
| memory width | 32 |
| Number of terminals | 72 |
| word count | 4194304 words |
| character code | 4000000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 4MX32 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SIMM |
| Encapsulate equivalent code | SSIM72 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| power supply | 5 V |
| Certification status | Not Qualified |
| refresh cycle | 1024 |
| Maximum seat height | 32.766 mm |
| Maximum standby current | 0.032 A |
| Maximum slew rate | 2.56 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | SINGLE |
| MSC23432B-80DS32 | MSC23432B-70DS32 | |
|---|---|---|
| Description | Fast Page DRAM Module, 4MX32, 80ns, CMOS, PSMA72, | Fast Page DRAM Module, 4MX32, 70ns, CMOS, PSMA72, |
| Maker | LAPIS Semiconductor Co., Ltd. | LAPIS Semiconductor Co., Ltd. |
| package instruction | SIMM, SSIM72 | SIMM, SSIM72 |
| Reach Compliance Code | unknown | unknown |
| Maximum access time | 80 ns | 70 ns |
| I/O type | COMMON | COMMON |
| JESD-30 code | R-PSMA-N72 | R-PSMA-N72 |
| memory density | 134217728 bit | 134217728 bit |
| Memory IC Type | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
| memory width | 32 | 32 |
| Number of terminals | 72 | 72 |
| word count | 4194304 words | 4194304 words |
| character code | 4000000 | 4000000 |
| Maximum operating temperature | 70 °C | 70 °C |
| organize | 4MX32 | 4MX32 |
| Output characteristics | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SIMM | SIMM |
| Encapsulate equivalent code | SSIM72 | SSIM72 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| refresh cycle | 1024 | 1024 |
| Maximum seat height | 32.766 mm | 32.766 mm |
| Maximum standby current | 0.032 A | 0.032 A |
| Maximum slew rate | 2.56 mA | 2.88 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal form | NO LEAD | NO LEAD |
| Terminal pitch | 1.27 mm | 1.27 mm |
| Terminal location | SINGLE | SINGLE |