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108-1050
3.2.
Materials
Materials used in the construction of this product shall be as specified on the applicable TE drawing.
A.
B.
C.
D.
3.3.
Contact: Phosphor bronze, tin or tin-lead plating and gold over nickel plating
Header: Thermoplastic polyester, UL 94V-0
Housing: Nylon 6/6 or Nylon 6/12, UL 94V-2 and UL 94V-0
Posts, header: Phosphor bronze, tin plating and gold over nickel plating
Ratings
A.
B.
C.
Voltage Rating: 250 VAC
Current Rating: See Figure 4 for applicable current carrying capability
Temperature Rating:
–55°C
to +105°C
3.4.
Performance Requirements and Test Description
The product should meet the electrical, mechanical and environmental performance requirements
specified in Figure 1. All tests shall be performed at ambient environmental conditions otherwise
specified.
3.5.
Test Requirements and Procedure Summary
Test Description
Requirement
Meets requirements of product drawing and
Application Spec 114-1019
Electrical
Procedure
Visual, dimensional and functional per
applicable quality inspection plan
Examination of product
Termination resistance
6 milliohms maximum initial.
ΔR
10 milliohms maximum
TE 109-6-1.
Subject mated contacts assembled in housing to
50 mv maximum open circuit at 100 ma
maximum.
See Figures 3 and 5
TE Spec 109-28-4.
Test between adjacent contacts of unmated
samples
TE Spec 109-29-1.
Test between adjacent contacts of unmated
samples
TE Spec 109-45-2.
Measure temperature rise vs current.
See Figures 4 and 5
Insulation resistance
5000 megohms minimum initial
Dielectric withstanding voltage
750 vac at sea level.
1 minute hold with no breakdown or
flashover
30°C maximum temperature rise at specified
current
Temperature rise vs current
Mechanical
Solderability
Termination tensile strength, parallel,
unmated
Solderable area shall have minimum of 95%
solder coverage
Wire Size (AWG)
28
24
22
Slot Tensile
(Pounds, minimum)
4
5
12
TE Spec 109-11-2.
Subject contacts to solderability
TE Spec 109-16.
Determine slot tensile at maximum rate of 1 inch
per minute. Pull parallel to terminated wire.
See Figure 6
Figure 1 (continued)
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108-1050
Termination tensile strength,
perpendicular, unmated
Slot Tensile
(Pounds, minimum)
1
1
3
TE Spec 109-21-1.
Subject mated samples to 10-55-10 Hz
traversed in 1 minute at 0.06 inch total
excursion. 2 hours in each of 3 mutually
perpendicular planes
TE Spec 109-26-1.
Subject mated samples to 50 G's halfsine shock
pulses of 11 milliseconds duration. 3 shocks in
each direction applied along 3 mutually
perpendicular planes, 18 total shocks
TE Spec 109-27.
Manually mate and unmate samples with friction
lock header for 25 cycles
TE Spec 109-42, Condition A.
Measure force necessary to mate samples with
friction lock header from point of initial contact to
depth of 0.200 inch at maximum rate of 0.5 inch
per minute
TE Spec 109-42, Condition A.
Measure force necessary to unmate samples
from friction lock header at maximum rate of 0.5
inch per minute
TE Spec 109-30
Measure post retention force at maximum rate of
0.5 inch per minute
TE Spec 109-16.
Determine slot tensile at maximum rate of 1 inch
per minute. Pull perpendicular to terminated
wire.
See Figure 6
Wire Size (AWG)
28
24
22
Vibration, sinusoidal
No discontinuities of 1 microsecond or longer
duration.
See Note
Physical shock
No discontinuities of 1 microsecond or longer
duration.
See Note
Durability
See Note
Mating force
2.4 pounds maximum average per contact
Unmating force
0.8 pound minimum average per contact
Post Retention Force
3 pound minimum average per contact
Environmental
Thermal shock
See Note
TE Spec 109-22.
Subject mated samples to 25 cycles between -
55 and 105°C
AMP Spec 109-23-3, Condition B.
Subject mated samples to 10 cycles between 25
and 65°C at 95% RH
AMP Spec 109-43. Subject mated samples to
temperature life at 85°C for 1000 hours
AMP Spec 109-85-3.
Subject mated samples to environmental class
III for 20 days
TE Spec 109-202, Condition C.
The solder bath temperature shall be maintained
at 260 +0/-5℃. The hold time in the solder shall
be 5 +2/-0 seconds
Humidity-temperature cycling
See Note
Temperature life
Mixed flowing gas
See Note
See Note
Resistance to soldering heat
See Note
Figure 1 (end)
Rev L
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108-1050
NOTE
Shall meet visual requirements, show no physical damage, and meet requirements of additional
tests as specified in the Product Qualification and Requalification Test Sequence Figure 2.
3.6.
Product Qualification and Requalification Test Sequence
TEST OR EXAMINATION
Examination of product
Termination resistance
Insulation resistance
Dielectric withstanding voltage
Temperature rise vs current
Solderability
Termination tensile strength
Vibration
Physical shock
Durability
Mating force
Unmating force
Post retention force
Thermal shock
Humidity-temperature cycling
Temperature life
Mixed flowing gas
Resistance to soldering heat
1
2(c)
TEST GROUP (a)
3(d)
4
5
TEST SEQUENCE (b)
6
7
8
1, 9
3, 7
1,9
2,7
1,5
2,4
1,8
2,6
3,7
1,3
1,3
1,3
1,3
3,8
2
2(f)
5
6
4
2
8
6(e)
2
4(g)
5
3(g)
2
Figure 2
4
5
NOTE
(a) Samples shall be prepared in accordance with applicable Instruction Sheets and shall be
selected at random from current production. Test group 1 shall consist of 5, 6 position
standard tin-lead plated samples and 5, 6 position gold plated samples. All samples shall be
terminated to the maximum wire size and mounted on printed circuit board PN 93-660017
(see Figure 5). Test group 2 shall consist of 3, 10 position standard tin-lead plated samples
terminated to 28 AWG wire and mounted on printed circuit board PN 93-660652; and 3, 10
position standard tin-lead plated samples terminated to 22 AWG wire and mounted on
printed circuit board PN 93-660651 (see Figure 5). Test group 3 shall consist of 3, 10
position gold plated samples terminated to 22 AWG wire and mounted on printed circuit
board PN 93-660017. Test group 4 shall consist of 5 unmounted 24 position standard tin-
lead plated samples terminated to the maximum wire size. Test group 5 shall consist of 6,
10 position standard tin-lead plated samples terminated to 28 AWG wire; 6, 10 position
standard tin-lead plated samples terminated to 24 AWG wire; and 6, 10 position standard
tin-lead plated samples terminated to 22 AWG wire. All samples shall be unmated and
unmounted. Test group 6 shall consist of 5, 6 position 0.100 inch friction lock tin-lead plated
headers.
(b) Numbers indicate sequence in which tests are performed.
(c) Tin-lead plated samples.
(d) Gold plated samples.
(e) Discontinuities shall not be measured. Energize at 18°C level for 100% loadings per Test
Specification 109-151.
(f) Subject half the samples to the parallel tensile test and the remaining half to the
perpendicular tensile test.
(g) Precondition samples with 5 cycles durability
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108-1050
NOTE
(a) Termination resistance equals millivolts divided by test current less resistance of 2 inches of
wire.
(b) After wave soldering, the boards and posts shall be cleaned to remove all flux and
contaminates.
Figure 3:
Temperature and Termination Resistance Measurement Points
Parallel - Fundamental Quartz Crystal, 7.999MHz Nom,
Series - Fundamental Quartz Crystal, 7.999MHz Nom,
CMOS, Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 6 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 6 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD)
Parallel - Fundamental Quartz Crystal,
10 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
(4-641193-7) 17P MTA100 CONN ASSY GRN LF
5 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
03P MTA100 HDR ASSY RA POL AU
9 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
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