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2-345850-5

Description
SOCKET, DIP24, IC SOCKET
CategoryThe connector    socket   
File Size94KB,1 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Download Datasheet Parametric View All

2-345850-5 Overview

SOCKET, DIP24, IC SOCKET

2-345850-5 Parametric

Parameter NameAttribute value
Reach Compliance Codeunknow
ECCN codeEAR99
Other featuresVERTICAL MOUNT DIP SOCKET
Contact to complete cooperationTIN
Contact completed and terminatedTIN LEAD OVER NICKEL
Device slot typeIC SOCKET
Type of equipment usedDIP24
JESD-609 codee0
Manufacturer's serial number345850
Number of contacts24
Base Number Matches1
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2-345850-5 Product Details
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2-345850-5
T E I nternal N umber: 2 - 3 4 5 8 5 0 - 5
Product Highlights:
l
DIP Socket
l
Number of Positions = 24
l
Row-to-Row Spacing = 7.62 mm
l
Through Hole C ontact Termination Type
l
Mount Style = Vertical
View all Features
Obsolete
C ontact Product Information
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Documentation & Additional Information
Product Drawings:
l
None Available
Catalog Pages/Data Sheets:
l
None Available
Product Specifications:
l
None Available
Application Specifications:
l
None Available
Instruction Sheets:
l
None Available
CAD Files:
l
None Available
Additional Information:
l
Product Line Information
Related Products:
l
Tooling
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
l
Product Type
= DIP Socket
l
Number of Positions
= 24
l
Profile = Standard
l
Frame Style
= Open
l
Leg Style
= Wire Wrap
Electrical Characteristics:
l
Insulation Resistance (M?) = 10,000
l
C ontact Resistance (m?) = 30
Termination Related Features:
l
Termination Post Length (mm [in])
= 9.40 [0.370]
l
Solder Tail C ontact Plating = Tin-Lead over Nickel
Body Related Features:
l
Row-to-Row Spacing (mm [in])
= 7.62 [0.300]
l
Mount Style
= Vertical
l
C enterline (mm [in])
= 2.54 [0.100]
Contact Related Features:
l
C ontact Termination Type
= Through Hole
l
C ontact Base Material
= Beryllium C opper
l
C ontact Mating Area Plating Material
= Tin
l
C ontact Style
= Screw Machine
l
Mating C ontact Type
= Inner Spring
Configuration Related Features:
l
Height Above PC Board (mm [in])
= 2.80 [0.110]
Industry Standards:
l
RoHS/ELV C ompliance
= Not reviewed for ELV/RoHS compliance
l
Lead Free Solder Processes
= Not reviewed for lead free solder
process
Conditions for Usage:
l
Temperature Range (?C ) = 105
Packaging Related Features:
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Packaging Method
= Tube
Other:
l
Brand = AMP
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