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SN74CBTS3306PWE4

Description
Dual FET Bus Switch With Schottky Diode Clamping 8-TSSOP -40 to 85
Categorylogic    logic   
File Size1020KB,13 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
Related ProductsFound19parts with similar functions to SN74CBTS3306PWE4
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SN74CBTS3306PWE4 Overview

Dual FET Bus Switch With Schottky Diode Clamping 8-TSSOP -40 to 85

SN74CBTS3306PWE4 Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeSOIC
package instructionTSSOP, TSSOP8,.25
Contacts8
Reach Compliance Codecompli
Factory Lead Time6 weeks
Other featuresBUS SWITCH
Control typeENABLE LOW
Counting directionBIDIRECTIONAL
seriesCBT/FST/QS/5C/B
JESD-30 codeR-PDSO-G8
JESD-609 codee4
length3 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUS DRIVER
Humidity sensitivity level1
Number of digits2
Number of functions1
Number of ports2
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTUBE
Peak Reflow Temperature (Celsius)260
power supply5 V
Maximum supply current (ICC)0.003 mA
Prop。Delay @ Nom-Su0.25 ns
propagation delay (tpd)0.35 ns
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
translateN/A
width4.4 mm

SN74CBTS3306PWE4 Related Products

SN74CBTS3306PWE4 SN74CBTS3306D SN74CBTS3306PW SN74CBTS3306DR SN74CBTS3306PWR
Description Dual FET Bus Switch With Schottky Diode Clamping 8-TSSOP -40 to 85 Dual FET Bus Switch With Schottky Diode Clamping 8-SOIC -40 to 85 Dual FET Bus Switch With Schottky Diode Clamping 8-TSSOP -40 to 85 Dual FET Bus Switch With Schottky Diode Clamping 8-SOIC -40 to 85 Dual FET Bus Switch With Schottky Diode Clamping 8-TSSOP -40 to 85
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to
Parts packaging code SOIC SOIC SOIC SOIC SOIC
package instruction TSSOP, TSSOP8,.25 SOP, SOP8,.25 TSSOP-8 SOP, SOP8,.25 TSSOP, TSSOP8,.25
Contacts 8 8 8 8 8
Reach Compliance Code compli compli compli compli compli
Factory Lead Time 6 weeks 1 week 1 week 1 week 1 week
Other features BUS SWITCH BUS SWITCH BUS SWITCH BUS SWITCH BUS SWITCH
Control type ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW
Counting direction BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL
series CBT/FST/QS/5C/B CBT/FST/QS/5C/B CBT/FST/QS/5C/B CBT/FST/QS/5C/B CBT/FST/QS/5C/B
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
JESD-609 code e4 e4 e4 e4 e4
length 3 mm 4.9 mm 4.4 mm 4.9 mm 3 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
Humidity sensitivity level 1 1 1 1 1
Number of digits 2 2 2 2 2
Number of functions 1 1 1 1 1
Number of ports 2 2 2 2 2
Number of terminals 8 8 8 8 8
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Output polarity TRUE TRUE TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SOP TSSOP SOP TSSOP
Encapsulate equivalent code TSSOP8,.25 SOP8,.25 TSSOP8,.25 SOP8,.25 TSSOP8,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing TUBE TUBE TUBE TR TR
Peak Reflow Temperature (Celsius) 260 260 260 260 260
power supply 5 V 5 V 5 V 5 V 5 V
Maximum supply current (ICC) 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA
Prop。Delay @ Nom-Su 0.25 ns 0.25 ns 0.25 ns 0.25 ns 0.25 ns
propagation delay (tpd) 0.35 ns 0.35 ns 0.35 ns 0.35 ns 0.35 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.75 mm 1.2 mm 1.75 mm 1.2 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4 V 4 V 4 V 4 V 4 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 1.27 mm 0.65 mm 1.27 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
translate N/A N/A N/A N/A N/A
width 4.4 mm 3.91 mm 3 mm 3.91 mm 4.4 mm
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments -
Base Number Matches - 1 - 1 1

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