MC68HC08GZ32MFA datasheet, PDF

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MC68HC08GZ32MFA: Description8-BIT, MROM, 8MHz, MICROCONTROLLER, PQFP48, 7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MS-026BBC, LQFP-48; CategoryThe embedded processor and controller Microcontrollers and processors; File Size4MB，320 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC68HC08GZ32MFA Overview

8-BIT, MROM, 8MHz, MICROCONTROLLER, PQFP48, 7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MS-026BBC, LQFP-48

MC68HC08GZ32MFA Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	NXP
Parts packaging code	QFP
package instruction	7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MS-026BBC, LQFP-48
Contacts	48
Reach Compliance Code	compliant
ECCN code	3A991.A.2
Has ADC	YES
Other features	ALSO OPERATES AT 3.3V AT 4 MHZ
Address bus width
bit size	8
CPU series	68HC08
maximum clock frequency	32 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	S-PQFP-G48
JESD-609 code	e0
length	7 mm
Number of I/O lines	37
Number of terminals	48
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP48,.35SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3/5 V
Certification status	Not Qualified
RAM (bytes)	1536
rom(word)	32256
ROM programmability	MROM
Maximum seat height	1.6 mm
speed	8 MHz
Maximum slew rate	30 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

MC68HC08GZ32MFA Preview

MC68HC08GZ32

Data Sheet

M68HC08

Microcontrollers

MC68HC08GZ32

Rev. 3.0

10/2006

freescale.com

MC68HC08GZ32

Data Sheet

To provide the most up-to-date information, the revision of our documents on the World Wide Web will be

the most current. Your printed copy may be an earlier revision. To verify you have the latest information

available, refer to:

http://freescale.com/

Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.

MC68HC08GZ32 Data Sheet, Rev. 3

Freescale Semiconductor

Revision History

The following revision history table summarizes changes contained in this document. For your

convenience, the page number designators have been linked to the appropriate location.

Revision History

Date

December,

2004

September,

2005

Revision

Level

0.1

1.0

Partial release

Full release

Figure 2-1. Memory Map — Corrected unimplemented area of figure.

Figure 2-2. Control, Status, and Data Registers — Removed daggers from

locations $001E and $001F.

Table 2-1. Vector Addresses — Corrected description for vectors IF20–IF17.

April,

2006

2.0

Chapter 10 Low-Power Modes — Corrected chapter title.

10.5 Clock Generator Module (CGM) — Updated description to remove

erroneous information.

11.3 Functional Description — Reworked description for accuracy and clarity.

Table 14-6. ESCI LIN Control Bits — Corrected functionality column.

1.6 Unused Pin Termination

— Added new section

12.2 Features

— Corrected timer link connection from TIM2 channel 0 to

TIM1 channel 0,

October,

2006

3.0

12.9 Timer Link

— Corrected timer link connection from TIM2 channel 0 to

TIM1 channel 0.

13.1 Introduction

— Replaced note with unused pin termination text.

21.5 5.0-Vdc Electrical Characteristics

and

21.6 3.3-Vdc Electrical Characteristics

— Updated DC injection current

specification.

Description

Page

Number(s)

N/A

103

104

111

190

115

126

147

295

297

MC68HC08GZ32 Data Sheet, Rev. 3

Freescale Semiconductor

List of Chapters

Chapter 1 General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Chapter 2 Memory Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Chapter 3 Analog-to-Digital Converter (ADC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Chapter 4 Clock Generator Module (CGM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Chapter 5 Mask Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

Chapter 6 Computer Operating Properly (COP) Module . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

Chapter 7 Central Processor Unit (CPU). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

Chapter 8 External Interrupt (IRQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91

Chapter 9 Keyboard Interrupt Module (KBI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

Chapter 10 Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

Chapter 11 Low-Voltage Inhibit (LVI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

Chapter 12 MSCAN08 Controller (MSCAN08). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

Chapter 13 Input/Output (I/O) Ports. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147

Chapter 14 Enhanced Serial Communications Interface (ESCI) Module . . . . . . . . . . . . . 167

Chapter 15 System Integration Module (SIM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199

Chapter 16 Serial Peripheral Interface (SPI) Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217

Chapter 17 Timebase Module (TBM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237

Chapter 18 Timer Interface Module (TIM1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .241

Chapter 19 Timer Interface Module (TIM2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .257

Chapter 20 Development Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 277

Chapter 21 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 293

Chapter 22 Ordering Information and Mechanical Specifications . . . . . . . . . . . . . . . . . . 309

MC68HC08GZ32 Data Sheet, Rev. 3

Freescale Semiconductor

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MC68HC08GZ32MFA Related Products

	MC68HC08GZ32MFA	MC68HC08GZ32CFA
Description	8-BIT, MROM, 8MHz, MICROCONTROLLER, PQFP48, 7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MS-026BBC, LQFP-48	8-BIT, MROM, 8MHz, MICROCONTROLLER, PQFP48, 7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MS-026BBC, LQFP-48
Is it lead-free?	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible
Maker	NXP	NXP
Parts packaging code	QFP	QFP
package instruction	7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MS-026BBC, LQFP-48	7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MS-026BBC, LQFP-48
Contacts	48	48
Reach Compliance Code	compliant	compliant
ECCN code	3A991.A.2	3A991.A.2
Has ADC	YES	YES
Other features	ALSO OPERATES AT 3.3V AT 4 MHZ	ALSO OPERATES AT 3.3V AT 4 MHZ
bit size	8	8
CPU series	68HC08	68HC08
maximum clock frequency	32 MHz	32 MHz
DAC channel	NO	NO
DMA channel	NO	NO
JESD-30 code	S-PQFP-G48	S-PQFP-G48
JESD-609 code	e0	e0
length	7 mm	7 mm
Number of I/O lines	37	37
Number of terminals	48	48
Maximum operating temperature	125 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
PWM channel	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	LFQFP
Encapsulate equivalent code	QFP48,.35SQ,20	QFP48,.35SQ,20
Package shape	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3/5 V	3.3/5 V
Certification status	Not Qualified	Not Qualified
RAM (bytes)	1536	1536
rom(word)	32256	32256
ROM programmability	MROM	MROM
Maximum seat height	1.6 mm	1.6 mm
speed	8 MHz	8 MHz
Maximum slew rate	30 mA	30 mA
Maximum supply voltage	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	AUTOMOTIVE	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	7 mm	7 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER

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