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114-1044
2.4. Specifications
Product Specification 108-1066 provides performance and test information for these sockets.
Specification 109-11 gives information pertaining to the solderability of metallic surfaces. Specification 101-21
gives information pertaining to solder fillets of surface mount-connectors. Specification 118-52000 gives
information pertaining to the application of surface-mount connectors to printed circuit (pc) boards using solder
paste.
2.5. Manuals
Manual 402-40 is available upon request and can be used as a guide in soldering. This manual provides
information on various flux types and characteristics along with commercial designation and flux removal
procedures. A checklist is included in the manual as a guide for information on soldering problems.
3. REQUIREMENTS
3.1. Printed Circuit Boards
A. Tolerances
1. Maximum allowable bow of the pc board will be 0.13 mm [.005 in.].
2. Coplanarity of plated pads on the pc board will be 0.03 mm [.001 in.].
3. If a solder mask is used, it must allow full clearance around the pads as defined in Figure 2.
B. Material
1. Board material will be glass epoxy (FR-4, G-10). Consult TE Engineering for suitability of other pc
board materials.
2. Minimum board thickness shall be 0.81 mm [.032 in.] nominal. For suitability with other pc board
thicknesses, contact TE Engineering.
C. Recommended Board Layout
Recommended pattern and dimensions, as well as tolerances, are shown in Figure 2.
D. Solderability
Plated pads on the pc board will be solderable as defined in TE Specification 109-11-2. Additional
information on solderability and soldering variables can be found in Manual 402-40.
Figure 2
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3.2. Solder Paste
A. Composition
1. Alloy type will be one of the following:
a. 63 Sn/37 Pb
b. 60 Sn/40 Pb
c. 62 Sn/36 Pb/2 Ag
2. Flux incorporated in the paste will be a Rosin, Mildly Active (RMA) Type.
3. Paste will be 45% to 55% solids by volume.
B. Volume Requirements
Recommended solder paste volume on each pad before curing is (2.89 x 10
-2
)
3
mm [(4.48 x 10
-5
)
3
in.]. An
outgassing factor (usually measured to be around 50%) will reduce the paste volume after curing. Since
solder paste can be deposited with a stencil or screen, the following calculations should serve as a guideline
in varying deposition parameters.
1. Stencils
Let V
i
= Solder Paste volume before curing
a = Aperture dimension corresponding to pad width
b = Aperture dimension corresponding to pad length
T
p
= thickness of stencil (or deposited solder paste)
If the aperture dimensions on the stencil are the same as the nominal pad dimensions shown in Figure 2,
stencil thickness can be calculated with the following relation:
T
p
= V
i
/ (a x b)
= (2.89 x 10
-5
)
3
/ (1.42 x .57) [(4.48 x 10
-5
)
3
/ (0.56 x -101)]
= 0.20 [.008]
Varying aperture dimensions will change the required stencil thickness needed to deposit the
recommended solder paste volume.
2. Screens
Let T
e
= Screen emulsion thickness
T
w
= Screen weave thickness
A
o
= Decimal equivalent of percent open area
T
p
= Thickness of deposited solder paste
Weave thickness and percent open area are dependent on the mesh count of the solder screen. For
example, an 80-mesh screen has a 49.5% open area and nominal weave thickness of 0.20 mm
[.008 in.]. The amount of paste deposited through a solder screen is dependent on aperture dimensions,
the wire mesh, and applied emulsion.
For an 80-mesh screen with the same aperture dimensions as used in the stencil example above, the
emulsion can be calculated by:
T
e
= T
p
- (T
w
x A
o
) = 0.20 - (0.20 x 12.57) = 0.10 [.008-(.008 x .495) = .004]
Varying aperture dimensions and mesh count will change the required emulsion thickness needed to
deposit the recommended solder paste volume.
NOTE
Using paste volume in excess of those recommended could result in excessive wicking of reflowed solder up the solder
tine, resulting in reduction of compliance and potential solder joint failure.
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Use recommended vendor specifications for paste processing. Additional information on soldering
processes and variables can be found in Manual 402-40.
3.3. Socket Placement
A. Registration
1. Sockets may be placed on the pc board by hand. After placement, no solder tines shall overhang the
solder pads. Solder tines may be flush with the pad edge.
2. Solder tine positioning on the pads for automatic application tooling is the same as for hand
application. In addition, clearances around the socket may be required depending on the type of pickup
equipment employed (external grippers or vacuum). For reliable placement, total equipment accuracy
(i.e. pickup head, centering fingers, fixtures, repeatability) must be within ±0.089 mm [±.0035 in.].
B. Seating Forces
The force required to seat the socket into the paste will be 24.9 ±0.57 Newton [.88 ±.02 oz] multiplied by the
number of contact positions.
3.4. Soldering Procedures
A. Temperature and Time
The reflow temperature to which the socket body is subjected to shall not exceed 220°C [428°F] for more
than three minutes.
B. Process
Socket design is compatible with vapor phase and infrared reflow solder processing. For suitability with other
reflow methods, contact TE Engineering. Additional information on soldering and soldering variables can be
found in Manual 402-40.
3.5. Cleaning
Fluxes, residues, and activators must be removed. Cleaning procedures depend on the type of flux used on the
solder line. The following cleaning compounds and chemicals may be used on these sockets for a period of up
to ten minutes without no harmful effects.
CLEANER
NAME
ALPHA 2110
BIOACT EC-7
Butyl CARBITOL
Isopropyl Alcohol
KESTER 5778
KESTER 5779
LONCOTERGE 520
LONCOTERGE 530
Terpene
TYPE
Aqueous
Solvent
Solvent
Solvent
Aqueous
Aqueous
Aqueous
Aqueous
Solvent
Figure 3
DANGER
TIME
(Minutes)
1
5
1
TEMPERATURE
(Maximum)
132°C [270°F]
100°C [212°F]
Ambient Room
5
100°C [212°F]
STOP
NOTE
Consideration must be given to toxicity and safety requirements recommended on the Material Safety Data Sheet
furnished by the solvent manufacturer
.
If you have a particular solvent that is not listed, consult an TE Representative before using it on these connectors.
i
ALPHA, BIOACT, CARBITOL, LONCOTERGE, and KESTER are trademarks of their respective owners.
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CAUTION
Excessive temperature may cause housing degradation or plating deterioration.
!
3.6. Inspection
1. All solder joints should comply with TE Workmanship Standard 201-21.
2. Socket shall be firmly attached to the pc board; There shall be no evidence of looseness or socket
movement. Maximum clearance between socket standoffs and the pc board shall be 0.38 mm [.015 in.].
3. There shall be no evidence of any damage to the socket as a result of application tooling.
4. QUALIFICATIONS
Surface-Mount DIPLOMATE DL DIP Sockets are Listed by Underwriters Laboratories Inc. (UL) in UL File
Number E28476, and Certified by CSA International, in CSA File Number LR7189A-307.
5. TOOLING
5.1. PC Board Support
A pc board support must be used to prevent bowing of the pc board during the placement of connectors on the
pc board. See Figure 4
5.2. Robotic Equipment for Insertion
The robotic equipment must have a true position accuracy tolerance of ±0.13 mm [.005 in.] to properly locate the
connector for insertion. This includes gripper and fixture tolerances as well as equipment repeatability. Insertion
location will be programmed by a pantograph/template system or software package. The equipment must use
the connector datum surfaces detailed on the TE Customer Drawing to ensure reliable connector placement.
TE machines have been designed for a variety of application requirements. See Figure 4.
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