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2-382466-1

Description
SOCKET, DIP24, IC SOCKET
CategoryThe connector    socket   
File Size105KB,1 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Download Datasheet Parametric View All

2-382466-1 Overview

SOCKET, DIP24, IC SOCKET

2-382466-1 Parametric

Parameter NameAttribute value
Reach Compliance Codeunknow
ECCN codeEAR99
Contact to complete cooperationTIN
Contact completed and terminatedTIN
Device slot typeIC SOCKET
Type of equipment usedDIP24
Shell materialGLASS FILLED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE
JESD-609 codee3
Manufacturer's serial number382466
Number of contacts24
Base Number Matches1
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2-382466-1 Product Details
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2-382466-1
T E I nternal N umber: 2 - 3 8 2 4 6 6 - 1
Product Highlights:
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DIP Socket
l
Number of Positions = 24
l
Row-to-Row Spacing = 15.49 mm
l
Through Hole C ontact Termination Type
l
Mount Style = Vertical
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Obsolete
C ontact Product Information C enter
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Documentation & Additional Information
Product Drawings:
l
None Available
Catalog Pages/Data Sheets:
l
I C SOC KETS
(PDF, English)
Product Specifications:
l
None Available
Application Specifications:
l
Surface-Mount DIPLOMATE Dual Leaf (DL) In-Line Pakca...
(PDF, English)
Instruction Sheets:
l
None Available
CAD Files:
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None Available
List all Documents
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
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Product Type
= DIP Socket
l
Number of Positions
= 24
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Profile = Standard
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Frame Style
= Ladder
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Leg Style
= Straight
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Proprietary Name = DIPLOMATE DL
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C olor = Brown
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Qty./Tube = 17
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Qty. Tubes/Box = 100
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Product Series = Standard
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C omment = Through-hole sockets are compatible with surface
mount soldering practices.
Electrical Characteristics:
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Insulation Resistance (M?) = 10,000
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C ontact Resistance (m?) = 30
Termination Related Features:
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Termination Post Length (mm [in])
= 3.25 [0.128]
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Solder Tail C ontact Plating = Tin
Body Related Features:
l
Row-to-Row Spacing (mm [in])
= 15.49 [0.610]
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Mount Style
= Vertical
l
C enterline (mm [in])
= 2.54 [0.100]
Contact Related Features:
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C ontact Termination Type
= Through Hole
l
C ontact Base Material
= Beryllium C opper
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C ontact Mating Area Plating Material
= Tin
l
C ontact Style
= Stamped + Formed
l
Mating C ontact Type
= Dual Leaf
Housing Related Features:
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Housing Material = PC T, Glass Filled
l
Housing Flammability Rating = UL 94V-0
Configuration Related Features:
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Height Above PC Board (mm [in])
= 5.33 [0.210]
Industry Standards:
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RoHS/ELV C ompliance
= Not reviewed for ELV/RoHS compliance
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Lead Free Solder Processes
= Not reviewed for lead free solder
process
Conditions for Usage:
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Temperature Range (?C ) = 105
Operation/Application:
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Application = Production
Packaging Related Features:
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Packaging Method
= Tube
Other:
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Brand = AMP
Additional Information:
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Product Line Information
Related Products:
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Tooling
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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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