CMOS, Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD)
CMOS, Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD)
EH2600TS-36.864M Parametric
Parameter Name
Attribute value
Brand Name
Ecliptek
Is it lead-free?
Lead free
Is it Rohs certified?
conform to
Maker
ECLIPTEK
Parts packaging code
SMD 5.0mm x 7.0mm
Contacts
4
Manufacturer packaging code
SMD 5.0mm x 7.0mm
Reach Compliance Code
compliant
Other features
TRI-STATE; ENABLE/DISABLE FUNCTION; BULK
maximum descent time
6 ns
Frequency Adjustment - Mechanical
NO
frequency stability
100%
JESD-609 code
e4
Manufacturer's serial number
EH26
Installation features
SURFACE MOUNT
Nominal operating frequency
36.864 MHz
Maximum operating temperature
70 °C
Minimum operating temperature
Oscillator type
LVCMOS
Output load
30 pF
physical size
7.0mm x 5.0mm x 1.6mm
longest rise time
6 ns
Maximum supply voltage
3.6 V
Minimum supply voltage
3 V
Nominal supply voltage
3.3 V
surface mount
YES
maximum symmetry
60/40 %
Terminal surface
Nickel/Gold (Ni/Au)
EH2600TS-36.864M Preview
EH2600TS-36.864M
EH26 00
Series
RoHS Compliant (Pb-free) 3.3V 4 Pad 5mm x 7mm
Ceramic SMD LVCMOS High Frequency Oscillator
Frequency Tolerance/Stability
±100ppm Maximum
Operating Temperature Range
0°C to +70°C
RoHS
Pb
Nominal Frequency
36.864MHz
TS -36.864M
Pin 1 Connection
Tri-State (High Impedance)
Duty Cycle
50 ±10(%)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
36.864MHz
±100ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C,
Shock, and Vibration)
±5ppm/year Maximum
0°C to +70°C
3.3Vdc ±0.3Vdc
35mA Maximum (No Load)
2.7Vdc Minimum (IOH= -8mA)
0.5Vdc Maximum (IOH= +8mA)
6nSec Maximum (Measured at 20% to 80% of waveform)
50 ±10(%) (Measured at 50% of waveform)
30pF Maximum
CMOS
Tri-State (High Impedance)
70% of Vdd Minimum to enable output, 20% of Vdd Maximum to disable output, No Connect to enable
output.
±250pSec Maximum, ±100pSec Typical
±50pSec Maximum, ±40pSec Typical
10mSec Maximum
-55°C to +125°C
Aging at 25°C
Operating Temperature Range
Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Pin 1 Connection
Tri-State Input Voltage (Vih and Vil)
Absolute Clock Jitter
One Sigma Clock Period Jitter
Start Up Time
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 2/17/2010 | Page 1 of 5
EH2600TS-36.864M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
CONNECTION
Tri-State (High
Impedance)
Ground
Output
Supply Voltage
7.00
±0.15
3
5.00
±0.15
MARKING
ORIENTATION
2
1.4 ±0.1
5.08
±0.15
4
2.20
±0.15
1
1.4 ±0.2
3.68
±0.15
1
2
3
4
LINE MARKING
1
2
3
ECLIPTEK
36.864M
PXXYZZ
P=Configuration Designator
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
1.60 ±0.20
Suggested Solder Pad Layout
All Dimensions in Millimeters
2.0 (X4)
2.2 (X4)
2.88
Solder Land
(X4)
1.81
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 2/17/2010 | Page 2 of 5
EH2600TS-36.864M
OUTPUT WAVEFORM & TIMING DIAGRAM
TRI-STATE INPUT
V
IH
V
IL
CLOCK OUTPUT
V
OH
80% of Waveform
50% of Waveform
20% of Waveform
V
OL
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
t
PLZ
Fall
Time
Rise
Time
T
W
T
Duty Cycle (%) = T
W
/T x 100
t
PZL
Test Circuit for CMOS Output
Oscilloscope
Frequency
Counter
+
+
Power
Supply
_
+
Voltage
Meter
_
Current
Meter
_
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
0.01µF
(Note 1)
0.1µF
(Note 1)
Ground
C
L
(Note 3)
No Connect
or Tri-State
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and V
DD
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 2/17/2010 | Page 3 of 5
EH2600TS-36.864M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Temperatures shown are applied to body of device.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 2/17/2010 | Page 4 of 5
EH2600TS-36.864M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 240°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Temperatures shown are applied to body of device.
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 2/17/2010 | Page 5 of 5
CMOS, Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD)
CMOS, Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD)
Central topics:
Hi-Fi output measurement factors
Solution:
InductorLeakage inductanceSelf-resonance frequencyFrequency response
Let's talk about how to measure the output voltage of the transformer un...
Hello everyone,I use 2407A, RS pin connected to RC circuit reset (20K, 0.1uf),MP/MC connected to 3.3V, VCCP connected to highBut found:1. I can connect with EEWORLD simulator, but the assembly interfa...
In order to further understand the performance of MicroPython, we also did some addition and multiplication tests and compared them with the calculations in C language. We performed 1000,000 additions...
[align=left][color=#000000]This document introduces the cycle-by-cycle protection function of the digital power controller [font=Calibri]UCD3138[/font]. Welcome to download and share it [font=Calibri]...
Electric motors and internal combustion engines of the same power have similar torque levels. High power requires high torque, and torque determines a vehicle's acceleration speed, commonly known a...[Details]
Recently,
Xpeng Motors and Xinlian Integrated Circuit jointly announced the mass production of China's first hybrid silicon carbide product.
Designed and developed by Xpeng Motors and joint...[Details]
On August 22nd, Lantu Motors unveiled a new technology called "Lanhai Intelligent Hybrid" during a live broadcast of CCTV News' "Top Laboratory." The name sounds like another new term, but a closer...[Details]
Robotics
has become
LiDAR
's "second growth curve."
While LiDAR was still battling with its "pure vision" rivals in the automotive field, another field ignited the demand f...[Details]
The all-new MG4 was recently officially announced on the Ministry of Industry and Information Technology's (MIIT) new vehicle announcement. The all-new MG4's semi-solid-state battery version addres...[Details]
SMT placement machines are important equipment in surface mount technology (Surface Mount Technology). Their performance has a decisive impact on the quality and efficiency of electronic manufactur...[Details]
The 2025 China International Automotive Testing Exhibition will be held at the Shanghai World Expo Exhibition and Convention Center from August 27 to 29, 2025.
Clacton Seafront, UK, ...[Details]
Reflow soldering, as an electronics assembly process, has become a vital component of the electronics manufacturing industry. Choosing reflow soldering equipment is crucial for improving production...[Details]
On August 21st, BYD announced the launch of its next-generation "Little White Pile" product, the "Lingchong"
charging
pile
, which is now available for general sale. This charging pile feat...[Details]
Preface
Low-voltage motors are widely used in nonferrous metallurgical plants. Their abnormal operation not only impacts normal production but can also threaten human life. Therefore, providin...[Details]
With the advancement of science and technology and the promotion of green, energy-saving, and circular development, the demand for precise control and accurate measurement is increasing. In the pow...[Details]
Speaking of the problem of vehicle spontaneous combustion, whether it is a pure electric vehicle or a fuel vehicle, there will be incidents of spontaneous combustion. For the same spontaneous combu...[Details]
Civilian internal combustion engines operate in the range of approximately 1000-4000 rpm. This results in the engine's kinetic energy being ineffective at low or high rpm, making starting difficult...[Details]
The screen is the first thing you notice when evaluating a phone's quality. Its quality directly impacts both visual and operational performance. However, understanding mobile phone screens r...[Details]
0 Introduction
DVI (Digital Visual Interface) is a hot topic in current digital display research and application. Video processing technologies for DVI output not only address issues such as h...[Details]
Electronics Design Contest
京公网安备 11010802033920号
EEWORLD
