CMOS, Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD)
CMOS, Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD)
EH2600TTS-106.250M Parametric
Parameter Name
Attribute value
Brand Name
Ecliptek
Is it lead-free?
Lead free
Is it Rohs certified?
conform to
Maker
ECLIPTEK
Parts packaging code
SMD 5.0mm x 7.0mm
Contacts
4
Manufacturer packaging code
SMD 5.0mm x 7.0mm
Reach Compliance Code
compliant
Other features
TRI-STATE; ENABLE/DISABLE FUNCTION; BULK
maximum descent time
4 ns
Frequency Adjustment - Mechanical
NO
frequency stability
100%
JESD-609 code
e4
Manufacturer's serial number
EH26
Installation features
SURFACE MOUNT
Nominal operating frequency
106.25 MHz
Maximum operating temperature
70 °C
Minimum operating temperature
Oscillator type
LVCMOS
Output load
15 pF
physical size
7.0mm x 5.0mm x 1.6mm
longest rise time
4 ns
Maximum supply voltage
3.6 V
Minimum supply voltage
3 V
Nominal supply voltage
3.3 V
surface mount
YES
maximum symmetry
55/45 %
Terminal surface
Nickel/Gold (Ni/Au)
EH2600TTS-106.250M Preview
EH2600TTS-106.250M
EH26 00
Series
RoHS Compliant (Pb-free) 3.3V 4 Pad 5mm x 7mm
Ceramic SMD LVCMOS High Frequency Oscillator
Frequency Tolerance/Stability
±100ppm Maximum
Operating Temperature Range
0°C to +70°C
RoHS
Pb
Nominal Frequency
106.250MHz
T TS -106.250M
Pin 1 Connection
Tri-State (High Impedance)
Duty Cycle
50 ±5(%)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
106.250MHz
±100ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C,
Shock, and Vibration)
±5ppm/year Maximum
0°C to +70°C
3.3Vdc ±0.3Vdc
35mA Maximum (No Load)
2.7Vdc Minimum (IOH= -8mA)
0.5Vdc Maximum (IOH= +8mA)
4nSec Maximum (Measured at 20% to 80% of waveform)
50 ±5(%) (Measured at 50% of waveform)
15pF Maximum
CMOS
Tri-State (High Impedance)
70% of Vdd Minimum to enable output, 20% of Vdd Maximum to disable output, No Connect to enable
output.
±250pSec Maximum, ±100pSec Typical
±50pSec Maximum, ±40pSec Typical
10mSec Maximum
-55°C to +125°C
Aging at 25°C
Operating Temperature Range
Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Pin 1 Connection
Tri-State Input Voltage (Vih and Vil)
Absolute Clock Jitter
One Sigma Clock Period Jitter
Start Up Time
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 2/17/2010 | Page 1 of 5
EH2600TTS-106.250M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
CONNECTION
Tri-State (High
Impedance)
Ground
Output
Supply Voltage
7.00
±0.15
3
5.00
±0.15
MARKING
ORIENTATION
2
1.4 ±0.1
5.08
±0.15
4
2.20
±0.15
1
1.4 ±0.2
3.68
±0.15
1
2
3
4
LINE MARKING
1
2
3
ECLIPTEK
106.25M
PXXYZZ
P=Configuration Designator
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
1.60 ±0.20
Suggested Solder Pad Layout
All Dimensions in Millimeters
2.0 (X4)
2.2 (X4)
2.88
Solder Land
(X4)
1.81
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 2/17/2010 | Page 2 of 5
EH2600TTS-106.250M
OUTPUT WAVEFORM & TIMING DIAGRAM
TRI-STATE INPUT
V
IH
V
IL
CLOCK OUTPUT
V
OH
80% of Waveform
50% of Waveform
20% of Waveform
V
OL
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
t
PLZ
Fall
Time
Rise
Time
T
W
T
Duty Cycle (%) = T
W
/T x 100
t
PZL
Test Circuit for CMOS Output
Oscilloscope
Frequency
Counter
+
+
Power
Supply
_
+
Voltage
Meter
_
Current
Meter
_
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
0.01µF
(Note 1)
0.1µF
(Note 1)
Ground
C
L
(Note 3)
No Connect
or Tri-State
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and V
DD
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 2/17/2010 | Page 3 of 5
EH2600TTS-106.250M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Temperatures shown are applied to body of device.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 2/17/2010 | Page 4 of 5
EH2600TTS-106.250M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 240°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Temperatures shown are applied to body of device.
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 2/17/2010 | Page 5 of 5
CMOS, Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD)
CMOS, Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD)
What are the advantages of Wi-Fi 6 and 6E? It may not be easy to explain these advantages at once, so let's first see how Qorvo summarizes their advantages.Since the introduction of the 802.11 Wi-Fi s...
I really can't guarantee whether this wireless mouse can be completed as scheduled, but I will definitely try my best, that's all I can say.However, I still hope to have a chance to get in touch with ...
[i=s]This post was last edited by kit7828 on 2022-3-13 14:54[/i]The following two buttons can be found in the development documentation of Pingtouge:Key1 corresponds to pin PA11, and Key2 corresponds ...
When compiling a project under IAR, the .out file can be generated successfully through compilation and linking, but the bin file cannot be generated. The prompt is as followsIn fact, this problem occ...
On August 24th, Tesla CEO Elon
Musk
revealed information about the upcoming FSD V14, claiming it will outperform human drivers. Tesla FSD lead Ashok stated last year that FSD version 12.5, ...[Details]
According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Administration (USPTO) for a patent for a remote vehicle control system that may be used in future ...[Details]
As more and more consumers purchase new energy vehicles, the safety of electric vehicles has become a major concern. This has been particularly prominent following a series of electric vehicle fire...[Details]
What is "Car Electronic Fence"
Fleet managers can define a graphical area (regular or irregular) or divide it into administrative zones in Yamei Technology's vehicle backend management system ...[Details]
"Have you set your calendar reminder?"
On August 24, Nvidia Robotics' official account posted a photo of a black gift box on a social media platform, with an attached greeting card sig...[Details]
Recently, Tesla released the "Tesla Car Voice Assistant Terms of Use", announcing that the car voice assistant will be connected to the Doubao large model (Skylark large model) and DeepSeek Chat pr...[Details]
Spark plugs are an indispensable device for engines. As the saying goes, without spark plugs, the engine cannot work properly. The serious consequence is that when driving at high speeds, the engin...[Details]
1. Ease of Use: The HMI module should be designed to be simple and clear, allowing users to easily operate and configure the energy storage device.
2. Ease of Maintenance: The HMI module should...[Details]
In the electronics manufacturing industry, surface mount technology (SMT) placement machines are core equipment for production lines. However, with many different models available on the market, ch...[Details]
On August 22, according to CNBC's report today, the National Highway Traffic Safety Administration (NHTSA) is launching an investigation into Tesla, and the latter is questioned whether it has fail...[Details]
Learned the following information.
Customer product: industrial computer motherboard
Glue application area: CPU/BGA filling
Glue color requirements: black or t...[Details]
Before understanding single-phase control transformers, let's briefly understand what a single-phase transformer is. A single-phase transformer uses a single-phase input. Compared to a three-phase ...[Details]
A pure sine wave inverter has a good output waveform with very low distortion, and its output waveform is essentially the same as the AC waveform of the mains power grid. In fact, the AC power prov...[Details]
The second-generation Snapdragon W5+ and second-generation Snapdragon W5 platforms support users sending and receiving messages via satellite when there is no cellular and Wi-Fi coverage.
...[Details]
I recently read an article in the Wall Street Journal titled "We need the right to repair our gadgets" (reference original article: ). The author was very angry about the phenomenon of "planned obs...[Details]
RF/Wirelessly
京公网安备 11010802033920号
EEWORLD
