Product
Specification
System, Connector/Header, MTA 156
1.
1.1.
SCOPE
Content
108-1051
11Mar11 Rev J
This specification covers performance, tests and quality requirements for the TE Connectivity (TE) MTA
156 connector/header system. This system is mass terminated using insulation displacement
technology on .156 inch centerlines and mates with .045 inch square or round posts providing
interconnection between wires and posts mounted on printed circuit boards. Terminations are designed
for 26 through 18 AWG wire having .070 inch maximum insulation diameter for mass terminations and
.095 inch maximum insulation diameter for single terminations. Wires shall be UL approved or specify
insulation with temperature ratings compatible with specified operating temperatures.
1.2.
Qualification
When tests are performed on the subject product line, procedures specified in Figure 1 shall be used.
All inspections shall be performed using the applicable inspection plan and product drawing.
1.3.
Successful qualification testing on the subject product line was completed on 18Dec97. The
Qualification Test Report number for this testing is 110-1004. This documentation is on file at and
available from Engineering Practices and Standards (EPS).
APPLICABLE DOCUMENTS
The following TE documents form a part of this specification to the extent specified herein. Unless
otherwise specified, the latest edition of the document applies. In the event of conflict between the
requirements of this specification and the product drawing, the product drawing shall take precedence.
In the event of conflict between the requirements of this specification and the referenced documents,
this specification shall take precedence.
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3.
3.1.
109-1: Test Specification (General Requirements for Test Specifications)
109-151: Test Specification (Current Rating Verification)
109 Series: Test Specifications as indicated in Figure 1
110-1004: Qualification Test Report (System, Connector/Header, MTA 156)
114-1020: Application Specification (MTA 156 Connector)
2.
REQUIREMENTS
Design and Construction
Product shall be of the design, construction and physical dimensions specified on the applicable product
drawing.
3.2.
Materials
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Contact:
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High force: Phosphor bronze, tin-lead plating
•
Standard: Phosphor bronze, tin-lead or gold over nickel plating
Headers: Thermoplastic polyester, UL94V-0
Header posts: Brass, tin or gold over nickel plating
Housing: Nylon 6/6 or 6/12, UL94V-0 or UL94-2
©2011 Tyco Electronics Corporation, | Indicates change
a TE Connectivity Ltd. Company
*Trademark
All Rights Reserved
TE logo is a trademark.
For latest revision, visit our website at www.te.com/documents.
For Regional Customer Service, visit our website at www.te.com
Other products, logos, and company names might be trademarks of their respective owners.
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LOC B
108-1051
3.3.
Ratings
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3.4.
Voltage: 600 volts AC
Current: See Figure 4 for applicable current carrying capability
Temperature: -55 to 105°
C
Performance and Test Description
Product is designed to meet the electrical, mechanical and environmental performance requirements
specified in Figure 1. Unless otherwise specified, all tests shall be performed at ambient environmental
conditions per Test Specification 109-1.
3.5.
Test Requirements and Procedures Summary
Test Description
Requirement
Meets requirements of product
drawing and Application
Specification 114-1020.
ELECTRICAL
3 milliohms maximum initial.
∆R
5 milliohms maximum.
Procedure
Visual, dimensional and functional
per applicable quality inspection
plan.
TE Spec 109-6-6.
Subject mated contacts assembled
in housing to 20 millivolts maximum
open circuit at 100 milliampers
maximum.
See Figure 3.
TE Spec 109-28-4.
Test between adjacent contacts of
unmated samples.
Examination of product.
Termination resistance.
Insulation resistance.
5000 megohms minimum initial.
Dielectric withstanding voltage.
One minute hold with no breakdown TE Spec 109-29-1.
or flashover.
2.2 kilovolts AC at sea level.
Test between adjacent contacts of
unmated samples.
30° maximum temperatur e rise at TE Spec 109-45-2.
C
specified current.
Measure temperature rise vs
current.
See Figure 4.
MECHANICAL
Solderable area shall have
minimum of 95% solder coverage.
Wire Size
AWG
26
24
22
20
18
Slot Tensile
Pounds Minimum
5
8
12
17
30
AMP Spec 109-11-2.
Subject contacts to solderability.
AMP Spec 109-16.
Determine slot tensile strength by
pulling parallel to terminated wire at
maximum rate of 1 inch per minute.
See Figure 5.
Temperature rise vs current.
Solderability.
Termination tensile strength,
parallel, unmated.
Figure 1 (continued)
Rev J
2 of 10
108-1051
Test Description
Termination tensile strength,
perpendicular, unmated.
Wire Size
AWG
26
24
22
20
18
Requirement
Slot Tensile
Pounds Minimum
1.3
1.3
3.4
4.0
4.6
Procedure
TE Spec 109-16.
Determine slot tensile strength by
pulling perpendicular to terminated
wire at maximum rate of 1 inch per
minute.
See Figure 5.
Vibration, sinusoidal.
No discontinuities of 1 microsecond TE Spec 109-21-1.
or longer duration.
Subject mated samples to 10-55-10
See Note.
Hz traversed in 1 minute with 0.06
inch maximum total excursion. Two
hours in each of 3 mutually
perpendicular planes.
See Figure 6.
No discontinuities of 1 microsecond TE Spec 109-21-7.
or longer duration.
Subject mated samples to 3.15 G's
See Note.
rms between 5-500 Hz. Fifteen
minutes in each of 3 mutually
perpendicular planes.
See Figure 6.
No discontinuities of 1 microsecond TE Spec 109-26-1.
Subject mated samples to 50 G's
or longer duration.
See Note.
half-sine shock pulses of 11
milliseconds duration. Three shocks
in each direction applied along 3
mutually perpendicular planes, 18
total shocks.
See Figure 6.
See Note.
TE Spec 109-27.
With header mounted in fixture,
manually mate and unmate
samples for 25 cycles.
TE Spec 109-42, Condition A.
Measure force necessary to mate
samples with header at maximum
rate of .5 inch per minute. Calculate
force per contact.
TE Spec 109-42, Condition A.
Measure force necessary to unmate
samples from header at maximum
rate of .5 inch per minute. Calculate
force per contact.
Vibration, random.
Mechanical shock.
Durability.
Mating force.
Standard contact: 1.75 pounds
maximum per contact.
High force contact: 6 pounds
maximum per contact.
Gold contact: 1.25 pounds
maximum per contact.
Standard contact: .2 pound
minimum per contact.
High force contact: .7 pound
minimum per contact.
Gold contact: .1 pound minimum
per contact.
ENVIRONMENTAL
See Note.
Unmating force.
Thermal shock.
TE Spec 109-22.
Subject mated samples to 25 cycles
between -55 and 105°
C.
Figure 1 (continued)
Rev J
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108-1051
Test Description
Humidity/temperature cycling.
See Note.
Requirement
Procedure
TE Spec 109-23-3,
Condition B.
Subject mated samples to 10 cycles
between 25 and 65° at 95% RH.
C
TE Spec 109-43.
Subject mated samples to
temperature life at 105° for gold
C
plated contacts and 85° for tin
C
plated contacts for 1000 hours.
TE Spec 109-85-3.
Subject mated samples to
environmental class III for 20 days.
Temperature life.
See Note.
Mixed flowing gas.
See Note.
NOTE
Shall meet visual requirements, show no physical damage and shall meet requirements of
additional tests as specified in Test Sequence in Figure 2.
Figure 1 (end)
Rev J
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108-1051
3.6.
Product Qualification and Requalification Test Sequence
Test Group (a)
Test or Examination
Examination of product
Termination resistance
Insulation resistance
Dielectric withstanding voltage
Temperature rise vs current
Solderability
Tensile strength
Vibration, sinusoidal
Vibration, random
Mechanical shock
Durability
Mating force
Unmating force
Thermal shock
Humidity/temperature cycling
Temperature life
Mixed flowing gas
NOTE
(a)
(b)
(c)
(d)
(e)
4(e)
5
3(e)
6
4
2
8
4
5
5
6(d)
2(c)
3,8
2
1
1,9
3,7
2
1,9
2,7
2,6
3,7
3
1,8
4
1,5
2,4
5
1,3
6
1,3
Test Sequence (b)
See paragraph 4.1.A.
Numbers indicate sequence in which tests are performed.
Subject half the samples to parallel tensile test and the remaining half to the
perpendicular tensile test.
Discontinuities shall not be measured. Energize at 18
E
C level for 100% loadings per
Test Specification 109-151.
Precondition samples with 5 cycles durability.
Figure 2
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