Field Programmable Gate Array, 324 CLBs, 15600 Gates, 1296-Cell, CMOS, PBGA256
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | LSC/CSI |
| package instruction | BGA, BGA256,20X20,50 |
| Reach Compliance Code | unknown |
| Other features | MAX 223 I/OS; 1296 FLIP-FLOPS; TYP GATES = 15600 TO 35800 |
| Combined latency of CLB-Max | 3.7 ns |
| JESD-30 code | S-PBGA-B256 |
| JESD-609 code | e0 |
| Configurable number of logic blocks | 324 |
| Equivalent number of gates | 15600 |
| Number of entries | 223 |
| Number of logical units | 1296 |
| Output times | 223 |
| Number of terminals | 256 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 324 CLBS, 15600 GATES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Encapsulate equivalent code | BGA256,20X20,50 |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
| Certification status | Not Qualified |
| Maximum supply voltage | 5.25 V |
| Minimum supply voltage | 4.75 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | BALL |
| Terminal pitch | 1.27 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
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