DRV2604YZFR datasheet, PDF - EEWORLD Datasheet

DRV2604YZFR: DescriptionHaptic Driver for ERM/LRA with Waveform Memory and Smart Loop Architecture 9-DSBGA -40 to 85; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size2MB，63 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

Stay tuned Parametric Compare

DRV2604YZFR Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	DRV2604YZFR	-	-	View	Buy Now

Haptic Driver for ERM/LRA with Waveform Memory and Smart Loop Architecture 9-DSBGA -40 to 85

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	VFBGA,
Contacts	9
Reach Compliance Code	compli
ECCN code	EAR99
Interface integrated circuit type	INTERFACE CIRCUIT
JESD-30 code	S-XBGA-B9
JESD-609 code	e1
length	1.44 mm
Humidity sensitivity level	1
Number of functions	1
Number of terminals	9
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	VFBGA
Package shape	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Maximum seat height	0.625 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	2.5 V
Nominal supply voltage	3.6 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	1.44 mm
Base Number Matches	1

	DRV2604YZFR	DRV2604YZFT
Description	Haptic Driver for ERM/LRA with Waveform Memory and Smart Loop Architecture 9-DSBGA -40 to 85	Haptic Driver for ERM/LRA with Waveform Memory and Smart Loop Architecture 9-DSBGA -40 to 85
Brand Name	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free
Is it Rohs certified?	conform to	conform to
Parts packaging code	BGA	BGA
package instruction	VFBGA,	VFBGA,
Contacts	9	9
Reach Compliance Code	compli	compli
ECCN code	EAR99	EAR99
Interface integrated circuit type	INTERFACE CIRCUIT	INTERFACE CIRCUIT
JESD-30 code	S-XBGA-B9	S-XBGA-B9
JESD-609 code	e1	e1
length	1.44 mm	1.44 mm
Humidity sensitivity level	1	1
Number of functions	1	1
Number of terminals	9	9
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	UNSPECIFIED	UNSPECIFIED
encapsulated code	VFBGA	VFBGA
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Maximum seat height	0.625 mm	0.625 mm
Maximum supply voltage	5.5 V	5.5 V
Minimum supply voltage	2.5 V	2.5 V
Nominal supply voltage	3.6 V	3.6 V
surface mount	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL
Terminal pitch	0.5 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM
width	1.44 mm	1.44 mm
Base Number Matches	1	1

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components