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SM6S26A

Description
Trans Voltage Suppressor Diode, 4600W, Unidirectional, 1 Element, Silicon, DO-218AA,
CategoryDiscrete semiconductor    diode   
File Size81KB,3 Pages
ManufacturerGeneral Instrument Corp
Download Datasheet Parametric View All

SM6S26A Overview

Trans Voltage Suppressor Diode, 4600W, Unidirectional, 1 Element, Silicon, DO-218AA,

SM6S26A Parametric

Parameter NameAttribute value
MakerGeneral Instrument Corp
Reach Compliance Codeunknown
Other featuresUL FLAMMABILITY
Maximum breakdown voltage31.9 V
Minimum breakdown voltage28.9 V
Shell connectionANODE
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95 codeDO-218AA
JESD-30 codeR-PSSO-C1
Maximum non-repetitive peak reverse power dissipation4600 W
Number of components1
Number of terminals1
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
polarityUNIDIRECTIONAL
Certification statusNot Qualified
surface mountYES
technologyAVALANCHE
Terminal formC BEND
Terminal locationSINGLE
SM6S Series
ct
odu *
Pr ed
ew ent
N t
Pa
DO-218
0.628(16.0)
0.592(15.0)
0.539(13.7)
0.524(13.3)
Surface Mount Automotive
Transient Voltage Suppressor
Stand-off Voltage
10 to 36V
Peak Pulse Power
4600W
Mounting Pad Layout
DO-218AA
0.091(2.3)
0.067(1.7)
0.116(3.0)
0.093(2.4)
0.413(10.5)
0.374(9.5)
0.116(3.0)
0.093(2.4)
0.413(10.5) 0.342(8.7)
0.374(9.5) 0.327(8.3)
0.366(9.3)
0.343(8.7)
0.150(3.8)
0.126(3.2)
0.366(9.3)
0.343(8.7)
0.406(10.3)
0.382(9.7)
Dimensions in
inches and (millimeters)
0.606(15.4)
0.583(14.8)
*
Patent #’s:
LEAD 1
0.138(3.5)
0.098(2.5)
4,980,315
5,166,769
5,278,095
0.197(5.0)
0.185(4.7)
Features
0.028(0.7)
0.020(0.5)
0.098(2.5)
0.059(1.5)
0.028(0.7)
0.012(0.3)
LEAD 2/METAL HEATSINK
Mechanical Data
Case:
Molded plastic body, surface mount with heatsink
integrally mounted in the encapsulation
Terminals:
Plated, solderable per MIL-STD-750, Method 2026
Polarity:
Heatsink is anode
Mounting Position:
Any
Weight:
0.091 ounce, 2.58 grams
• Ideally suited for load dump protection
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
• High temperature stability due to unique oxide passiva-
tion and patented PAR
construction
• Integrally molded heatsink provides a very low thermal
resistance for maximum heat dissipation
• Low leakage current at T
J
= 175°C
• High temperature soldering guaranteed:
260°C for 10 seconds at terminals
• Meets ISO7637-2 surge spec.
• Low forward voltage drop
Maximum Ratings and Thermal Characteristics
(T
C
= 25°C unless otherwise noted)
Parameter
Peak pulse power dissipation with 10/1000µs waveform
10/10,000µs waveform
Steady state power dissipation
Peak pulse current with a 10/1000µs waveform
(NOTE 1)
Peak forward surge current, 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
(NOTE 2)
Typical thermal resistance junction to case
Operating junction and storage temperature range
Notes:
(1) Non-repetitive current pulse derated above T
A
=25°C
Symbol
P
PPM
P
D
I
PPM
I
FSM
R
ΘJC
T
J
, T
STG
Value
4600
3600
6.0
See Table 1
600
0.95
–55 to +175
Unit
W
W
A
A
°C/W
°C
7/20/99
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