IDT7M4003S30C datasheet, PDF - EEWORLD Datasheet

IDT7M4003S30C: DescriptionSRAM Module, 128KX8, 30ns, CMOS, CPGA66, SIDE BRAZED, CERAMIC, HIP-66; Categorystorage storage; File Size201KB，8 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT7M4003S30C Overview

SRAM Module, 128KX8, 30ns, CMOS, CPGA66, SIDE BRAZED, CERAMIC, HIP-66

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	PGA
package instruction	PGA,
Contacts	66
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	30 ns
Other features	CONFIGURABLE AS 32K X 32
Spare memory width	16
JESD-30 code	S-CPGA-P66
JESD-609 code	e0
memory density	1048576 bit
Memory IC Type	SRAM MODULE
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	66
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
Certification status	Not Qualified
Maximum seat height	6.223 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	30

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