MC68334GMFC20 datasheet, PDF - EEWORLD Datasheet

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MC68334GMFC20: Description32-BIT, 20MHz, MICROCONTROLLER, PQFP132, PLASTIC, QFP-132; CategoryThe embedded processor and controller Microcontrollers and processors; File Size445KB，76 Pages; ManufacturerMotorola ( NXP ); Websitehttps://www.nxp.com

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MC68334GMFC20 Overview

32-BIT, 20MHz, MICROCONTROLLER, PQFP132, PLASTIC, QFP-132

MC68334GMFC20 Parametric

Parameter Name	Attribute value
Maker	Motorola ( NXP )
Parts packaging code	QFP
package instruction	QFP,
Contacts	132
Reach Compliance Code	unknown
Has ADC	YES
Other features	EXT 32.768KHZ REFERENCE CRYSTAL; 12 PROGRAMMABLE CHIP SELECT SIGNALS
Address bus width	24
bit size	32
boundary scan	NO
maximum clock frequency	0.032768 MHz
DAC channel	NO
DMA channel	NO
External data bus width	16
Format	FIXED POINT
Integrated cache	NO
JESD-30 code	S-PQFP-G132
low power mode	YES
Number of DMA channels
Number of external interrupt devices	7
Number of I/O lines	30
Number of serial I/Os	1
Number of terminals	132
Number of timers	1
On-chip data RAM width	8
On-chip program ROM width
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Package shape	SQUARE
Package form	FLATPACK
Certification status	Not Qualified
RAM (number of words)	512
rom(word)	0
speed	20 MHz
surface mount	YES
technology	HCMOS
Temperature level	AUTOMOTIVE
Terminal form	GULL WING
Terminal location	QUAD
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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MOTOROLA

SEMICONDUCTOR

TECHNICAL DATA

Order this document

by MC68334TS/D REV. 1

MC68334

Technical Summary

32-Bit Modular Microcontroller

1 Introduction

The MC68334, a highly-integrated 32-bit microcontroller, combines high-performance data manipula-

tion capabilities with powerful peripheral subsystems. The MCU is built up from standard modules that

interface through a common intermodule bus (IMB). Standardization facilitates rapid development of

devices tailored for specific applications.

The MCU incorporates a 32-bit CPU (CPU32), a system integration module (SIM), an 8/10-bit analog-

to-digital converter (ADC), a time processor unit (TPU) and a 1-Kbyte static RAM module with TPU em-

ulation capability (TPURAM).

The MCU can either synthesize an internal clock signal from an external reference or use an external

clock input directly. Operation with a 32.768-kHz reference frequency is standard. The maximum sys-

tem clock speed is 20.97 MHz. System hardware and software allow changes in clock rate during op-

eration. Because MCU operation is fully static, register and memory contents are not affected by clock

rate changes.

High-density complementary metal-oxide semiconductor (HCMOS) architecture makes the basic power

consumption of the MCU low. Power consumption can be minimized by stopping the system clock. The

CPU32 instruction set includes a low-power stop (LPSTOP) command that efficiently implements this

capability.

This document contains information about a new product. Specifications and information herein are

subject to change without notice.

Table 1 Ordering Information

Package Type

132-Pin PQFP

TPU Type

Motion Control

Temperature

–40 to +85

–40 to +105

°C

–40 to +125

°C

Frequency

16 MHz

20 MHz

16 MHz

20 MHz

16 MHz

20 MHz

Order Number

MC68334GCFC16

MC68334GCFC20

MC68334GVFC16

MC68334GVFC20

MC68334GMFC16

MC68334GMFC20

SP Prefix

2-Piece

Tray

Order Quantity

No Affix

36-Piece

Tray

B1 Suffix

180

(5 Trays)

This document contains information on a new product. Speciﬁcations and information herein are subject to change without notice.

TABLE OF CONTENTS

Section

Page

Features ...................................................................................................................................... 3

Block Diagram ............................................................................................................................. 3

Pin Assignments .......................................................................................................................... 5

Address Map ............................................................................................................................... 6

Intermodule Bus .......................................................................................................................... 6

Signal Descriptions

Pin Characteristics ......................................................................................................................7

MCU Power Connections ............................................................................................................ 8

MCU Driver Types ....................................................................................................................... 8

Signal Characteristics ..................................................................................................................9

Signal Function ..........................................................................................................................10

System Integration Module

Overview ................................................................................................................................... 11

System Configuration and Protection Block .............................................................................. 13

System Clock ............................................................................................................................19

External Bus Interface ............................................................................................................... 24

Chip Selects ..............................................................................................................................28

General-Purpose Input/Output .................................................................................................. 35

Resets ....................................................................................................................................... 37

Interrupts ................................................................................................................................... 40

Factory Test Block .....................................................................................................................42

Central Processor Unit

Overview ................................................................................................................................... 43

Programming Model .................................................................................................................. 43

Status Register ..........................................................................................................................44

Data Types ................................................................................................................................45

Addressing Modes ..................................................................................................................... 45

Instruction Set Summary ........................................................................................................... 46

Background Debugging Mode ...................................................................................................49

Time Processor Unit

Overview ................................................................................................................................... 51

Programmer's Model .................................................................................................................51

TPU Components ...................................................................................................................... 52

TPU Operation ..........................................................................................................................54

Emulation Support .....................................................................................................................55

Time Functions ..........................................................................................................................55

TPU Registers ...........................................................................................................................57

Analog-to-Digital Converter Module

Analog Subsystem .................................................................................................................... 63

Digital Control Subsystem ......................................................................................................... 63

ADC Address Map ..................................................................................................................... 64

ADC Registers ...........................................................................................................................66

Standby RAM with TPU Emulation

Overview ................................................................................................................................... 72

TPURAM Register Block ........................................................................................................... 72

TPURAM Registers ................................................................................................................... 72

TPURAM Operation .................................................................................................................. 73

Summary of Changes

1.1

1.2

1.3

1.4

1.5

Introduction

2.1

2.2

2.3

2.4

2.5

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

4.1

4.2

4.3

4.4

4.5

4.6

4.7

5.1

5.2

5.3

5.4

5.5

5.6

5.7

6.1

6.2

6.3

6.4

7.1

7.2

7.3

7.4

MOTOROLA

MC68334

MC68334TS/D REV. 1

MC68334GMFC20 Related Products

	MC68334GMFC20	MC68334GCFC20	MC68334GMFC16	MC68334GVFC16	MC68334GCFC16	MC68334GVFC20
Description	32-BIT, 20MHz, MICROCONTROLLER, PQFP132, PLASTIC, QFP-132	32-BIT, 20MHz, MICROCONTROLLER, PQFP132, PLASTIC, QFP-132	32-BIT, 16MHz, MICROCONTROLLER, PQFP132, PLASTIC, QFP-132	Microcontroller, 32-Bit, 16MHz, HCMOS, PQFP132, PLASTIC, QFP-132	Microcontroller, 32-Bit, 16MHz, HCMOS, PQFP132, PLASTIC, QFP-132	32-BIT, 20MHz, MICROCONTROLLER, PQFP132, PLASTIC, QFP-132
Maker	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )
package instruction	QFP,	QFP,	QFP,	QFP,	PLASTIC, QFP-132	QFP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknow	unknow
Has ADC	YES	YES	YES	YES	YES	YES
Other features	EXT 32.768KHZ REFERENCE CRYSTAL; 12 PROGRAMMABLE CHIP SELECT SIGNALS	EXT 32.768KHZ REFERENCE CRYSTAL; 12 PROGRAMMABLE CHIP SELECT SIGNALS	EXT 32.768KHZ REFERENCE CRYSTAL; 12 PROGRAMMABLE CHIP SELECT SIGNALS	EXT 32.768KHZ REFERENCE CRYSTAL; 12 PROGRAMMABLE CHIP SELECT SIGNALS	EXT 32.768KHZ REFERENCE CRYSTAL; 12 PROGRAMMABLE CHIP SELECT SIGNALS	EXT 32.768KHZ REFERENCE CRYSTAL; 12 PROGRAMMABLE CHIP SELECT SIGNALS
Address bus width	24	24	24	24	24	24
bit size	32	32	32	32	32	32
boundary scan	NO	NO	NO	NO	NO	NO
maximum clock frequency	0.032768 MHz	0.032768 MHz	0.032768 MHz	0.032768 MHz	0.032768 MHz	0.032768 MHz
DAC channel	NO	NO	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO	NO	NO
External data bus width	16	16	16	16	16	16
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	NO	NO	NO	NO	NO	NO
JESD-30 code	S-PQFP-G132	S-PQFP-G132	S-PQFP-G132	S-PQFP-G132	S-PQFP-G132	S-PQFP-G132
low power mode	YES	YES	YES	YES	YES	YES
Number of external interrupt devices	7	7	7	7	7	7
Number of I/O lines	30	30	30	30	30	30
Number of serial I/Os	1	1	1	1	1	1
Number of terminals	132	132	132	132	132	132
Number of timers	1	1	1	1	1	1
On-chip data RAM width	8	8	8	8	8	8
Maximum operating temperature	125 °C	85 °C	125 °C	105 °C	85 °C	105 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	NO	NO	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	QFP	QFP	QFP	QFP	QFP
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (number of words)	512	512	512	512	512	512
speed	20 MHz	20 MHz	16 MHz	16 MHz	16 MHz	20 MHz
surface mount	YES	YES	YES	YES	YES	YES
technology	HCMOS	HCMOS	HCMOS	HCMOS	HCMOS	HCMOS
Temperature level	AUTOMOTIVE	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Parts packaging code	QFP	QFP	QFP	-	-	QFP
Contacts	132	132	132	-	-	132

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