UPD78P4038GC-XXX-8BT datasheet, PDF - EEWORLD Datasheet

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UPD78P4038GC-XXX-8BT: DescriptionMicrocontroller, 16-Bit, 32MHz, CMOS, PQFP80, 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, QFP-80; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，783 Pages; ManufacturerNEC Electronics

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UPD78P4038GC-XXX-8BT Overview

Microcontroller, 16-Bit, 32MHz, CMOS, PQFP80, 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, QFP-80

UPD78P4038GC-XXX-8BT Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	NEC Electronics
Parts packaging code	QFP
package instruction	LQFP,
Contacts	80
Reach Compliance Code	compliant
ECCN code	3A991.A.2
Has ADC	YES
Address bus width	20
bit size	16
maximum clock frequency	32 MHz
DAC channel	YES
DMA channel	NO
External data bus width	8
JESD-30 code	S-PQFP-G80
JESD-609 code	e0
length	14 mm
Number of I/O lines	64
Number of terminals	80
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.7 mm
speed	32 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	2.7 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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Document No. U11316EJ3V0UM00 (3rd edition)

Date Published September 1997 N

©

Printed in Japan

1996

NOTES FOR CMOS DEVICES

1

PRECAUTION AGAINST ESD FOR SEMICONDUCTORS

Note:

Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and

ultimately degrade the device operation. Steps must be taken to stop generation of static electricity

as much as possible, and quickly dissipate it once, when it has occurred. Environmental control

must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using

insulators that easily build static electricity. Semiconductor devices must be stored and transported

in an anti-static container, static shielding bag or conductive material. All test and measurement

tools including work bench and floor should be grounded. The operator should be grounded using

wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need

to be taken for PW boards with semiconductor devices on it.

2

HANDLING OF UNUSED INPUT PINS FOR CMOS

Note:

No connection for CMOS device inputs can be cause of malfunction. If no connection is provided

to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence

causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels

of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused

pin should be connected to V

DD

or GND with a resistor, if it is considered to have a possibility of

being an output pin. All handling related to the unused pins must be judged device by device and

related specifications governing the devices.

3

STATUS BEFORE INITIALIZATION OF MOS DEVICES

Note:

Power-on does not necessarily define initial status of MOS device. Production process of MOS

does not define the initial operation status of the device. Immediately after the power source is

turned ON, the devices with reset function have not yet been initialized. Hence, power-on does

not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the

reset signal is received. Reset operation must be executed immediately after power-on for devices

having reset function.

The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.

Purchase of NEC I

2

C components conveys a license under the Philips I

2

C Patent Rights to use these components in

an I

2

C system, provided that the sytem conforms to the I

2

C Standard Specification as defined by Philips.

The information in this document is subject to change without notice.

No part of this document may be copied or reproduced in any form or by any means without the prior written

consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in

this document.

NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property

rights of third parties by or arising from use of a device described herein or any other liability arising from use

of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other

intellectual property rights of NEC Corporation or others.

While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,

the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or

property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety

measures in its design, such as redundancy, fire-containment, and anti-failure features.

NEC devices are classified into the following three quality grades:

"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a

customer designated “quality assurance program“ for a specific application. The recommended applications of

a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device

before using it in a particular application.

Standard: Computers, office equipment, communications equipment, test and measurement equipment,

audio and visual equipment, home electronic appliances, machine tools, personal electronic

equipment and industrial robots

Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed

for life support)

Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems or medical equipment for life support, etc.

The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.

If customers intend to use NEC devices for applications other than those specified for Standard quality grade,

they should contact an NEC sales representative in advance.

Anti-radioactive design is not implemented in this product.

M7 96.5

UPD78P4038GC-XXX-8BT Related Products

	UPD78P4038GC-XXX-8BT	UPD78P4038GC-XXX-8BT-A
Description	Microcontroller, 16-Bit, 32MHz, CMOS, PQFP80, 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, QFP-80	Microcontroller, 16-Bit, 32MHz, CMOS, PQFP80, 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, QFP-80
Maker	NEC Electronics	NEC Electronics
Parts packaging code	QFP	QFP
package instruction	LQFP,	LQFP,
Contacts	80	80
Reach Compliance Code	compliant	unknown
ECCN code	3A991.A.2	3A991.A.2
Has ADC	YES	YES
Address bus width	20	20
bit size	16	16
maximum clock frequency	32 MHz	32 MHz
DAC channel	YES	YES
DMA channel	NO	NO
External data bus width	8	8
JESD-30 code	S-PQFP-G80	S-PQFP-G80
JESD-609 code	e0	e6
length	14 mm	14 mm
Number of I/O lines	64	64
Number of terminals	80	80
PWM channel	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	LQFP
Package shape	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.7 mm	1.7 mm
speed	32 MHz	32 MHz
Maximum supply voltage	5.5 V	5.5 V
Minimum supply voltage	2.7 V	2.7 V
Nominal supply voltage	5 V	5 V
surface mount	YES	YES
technology	CMOS	CMOS
Terminal surface	TIN LEAD	TIN BISMUTH
Terminal form	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm
Terminal location	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER

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