ISD1610BX01 datasheet, PDF - EEWORLD Datasheet

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ISD1610BX01: DescriptionSpeech Synthesizer With RCDG, 20s, DIE-16; CategoryAnalog mixed-signal IC Consumption circuit; File Size310KB，23 Pages; ManufacturerNuvoton Technology Corporation; Websitehttp://www.nuvoton.com.cn/hq/

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ISD1610BX01 Overview

Speech Synthesizer With RCDG, 20s, DIE-16

ISD1610BX01 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Nuvoton Technology Corporation
Parts packaging code	DIE
package instruction	DIE-16
Contacts	16
Reach Compliance Code	compliant
application	GREETING CARDS; TOYS; ANNUNCIATORS
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-XUUC-N16
Number of functions	1
Number of terminals	16
On-chip memory type	FLASH
Maximum operating temperature	50 °C
Minimum operating temperature
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum read time	20 s
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.4 V
surface mount	YES
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal location	UPPER
Maximum time at peak reflow temperature	NOT SPECIFIED

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PRELIMINARY

ISD1600B

Series

Single-Message

Single-Chip

6.6- to 40-Second

Voice Record & Playback Devices

with vAlert Option

Publication Release Date: Jan. 23, 2007

Revision 1.2

ISD1600B SERIES

TABLE OF CONTENTS

1. GENERAL DESCRIPTION.................................................................................................................. 3

2. FEATURES ......................................................................................................................................... 4

3. BLOCK DIAGRAM .............................................................................................................................. 5

4. PIN CONFIGURATION ....................................................................................................................... 6

5. PIN DESCRIPTION ............................................................................................................................. 7

6. FUNCTIONAL DESCRIPTION............................................................................................................ 9

6.1. Detailed Description .................................................................................................................... 9

6.1.1 Audio Quality....................................................................................................................... 9

6.1.2 Duration............................................................................................................................... 9

6.1.3 Flash Storage...................................................................................................................... 9

6.1.4 Basic Operation .................................................................................................................. 9

6.1.5 vAlert ................................................................................................................................... 9

6.1.6 Automatic Power-Down Mode ............................................................................................ 9

6.2. Functional Description Example................................................................................................ 10

6.2.1. Record a Message........................................................................................................... 10

6.2.2. Edge-trigger Playback...................................................................................................... 10

6.2.3. Level- trigger Playback .................................................................................................... 10

6.2.4. LED Operation ................................................................................................................. 10

6.2.5. R

OSC

Operation................................................................................................................. 10

7. TIMING DIAGRAMS.......................................................................................................................... 11

8. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 13

8.1 Operating Conditions.................................................................................................................. 14

9. ELECTRICAL CHARACTERISTICS ................................................................................................. 15

9.1. DC Parameters.......................................................................................................................... 15

9.2. AC Parameters .......................................................................................................................... 16

10. TYPICAL APPLICATION CIRCUIT ................................................................................................. 17

11. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 18

11.1. 16-Lead 150mil Small Outline Integrated Circuit (SOIC) Package ......................................... 18

11.2. 16-Lead 300mil Plastic Dual Inline Package (PDIP)............................................................... 19

11.3. Die Physical Layout ................................................................................................................. 20

12. ORDERING INFORMATION........................................................................................................... 21

13. VERSION HISTORY ....................................................................................................................... 22

-2-

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