Speech Synthesizer With RCDG, 32s, CMOS, PDIP28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Nuvoton Technology Corporation |
| package instruction | DIP, DIP28,.6 |
| Reach Compliance Code | unknown |
| Commercial integrated circuit types | SPEECH SYNTHESIZER WITH RCDG |
| JESD-30 code | R-PDIP-T28 |
| JESD-609 code | e0 |
| Number of terminals | 28 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum read time | 32 s |
| Maximum slew rate | 30 mA |
| surface mount | NO |
| technology | CMOS |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |

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| ISD2532PI | ISD2540SI | ISD2540PI | HCHP1206K6R98FF131 | ISD2532E | ISD2532EI | ISD2532SI | ISD2532X | ISD2548X | ISD2540E | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Speech Synthesizer With RCDG, 32s, CMOS, PDIP28 | Speech Synthesizer With RCDG, 40s, CMOS, PDSO28, | Speech Synthesizer With RCDG, 40s, CMOS, PDIP28, | Fixed Resistor, Metal Glaze/thick Film, 0.25W, 6.98ohm, 200V, 1% +/-Tol, -100,100ppm/Cel, 1206, | Speech Synthesizer With RCDG, 32s, CMOS, PDSO28, | Speech Synthesizer With RCDG, 32s, CMOS, PDSO28 | Speech Synthesizer With RCDG, 32s, CMOS, PDSO28 | Speech Synthesizer With RCDG | Speech Synthesizer With RCDG | Speech Synthesizer With RCDG, 40s, CMOS, PDSO28, |
| Reach Compliance Code | unknown | unknown | unknown | compliant | compliant | unknown | unknown | unknown | unknown | compliant |
| Number of terminals | 28 | 28 | 28 | 2 | 28 | 28 | 28 | 28 | 28 | 28 |
| Package form | IN-LINE | SMALL OUTLINE | IN-LINE | SMT | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | UNCASED CHIP | UNCASED CHIP | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Is it Rohs certified? | incompatible | incompatible | incompatible | conform to | - | incompatible | incompatible | - | - | - |
| Maker | Nuvoton Technology Corporation | Nuvoton Technology Corporation | Nuvoton Technology Corporation | - | Nuvoton Technology Corporation | Nuvoton Technology Corporation | Nuvoton Technology Corporation | Nuvoton Technology Corporation | Nuvoton Technology Corporation | Nuvoton Technology Corporation |
| package instruction | DIP, DIP28,.6 | SOP, SOP28,.4 | DIP, DIP28,.6 | - | TSSOP, TSSOP28,.53,22 | TSSOP, TSSOP28,.53,22 | SOP, SOP28,.4 | DIE, | DIE, | TSSOP, TSSOP28,.53,22 |
| Commercial integrated circuit types | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | - | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG |
| JESD-30 code | R-PDIP-T28 | R-PDSO-G28 | R-PDIP-T28 | - | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | X-XUUC-N28 | X-XUUC-N28 | R-PDSO-G28 |
| JESD-609 code | e0 | e0 | e0 | e2 | - | e0 | e0 | - | - | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP | DIP | - | TSSOP | TSSOP | SOP | DIE | DIE | TSSOP |
| Encapsulate equivalent code | DIP28,.6 | SOP28,.4 | DIP28,.6 | - | TSSOP28,.53,22 | TSSOP28,.53,22 | SOP28,.4 | - | - | TSSOP28,.53,22 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED | UNSPECIFIED | RECTANGULAR |
| power supply | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | - | - | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum read time | 32 s | 40 s | 40 s | - | 32 s | 32 s | 32 s | - | - | 40 s |
| Maximum slew rate | 30 mA | 30 mA | 30 mA | - | 30 mA | 30 mA | 30 mA | - | - | 30 mA |
| surface mount | NO | YES | NO | - | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | METAL GLAZE/THICK FILM | CMOS | CMOS | CMOS | - | - | CMOS |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Silver (Sn/Ag) - with Nickel (Ni) barrier | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | - |
| Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | - | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD | GULL WING |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | - | 0.55 mm | 0.55 mm | 1.27 mm | - | - | 0.55 mm |
| Terminal location | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | UPPER | UPPER | DUAL |