ISD2532PI datasheet, PDF - EEWORLD Datasheet

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ISD2532PI: DescriptionSpeech Synthesizer With RCDG, 32s, CMOS, PDIP28; CategoryAnalog mixed-signal IC Consumption circuit; File Size464KB，42 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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ISD2532PI Overview

Speech Synthesizer With RCDG, 32s, CMOS, PDIP28

ISD2532PI Parametric

Parameter Name	Attribute value
Maker	Winbond Electronics Corporation
package instruction	DIP, DIP28,.6
Reach Compliance Code	unknown
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-PDIP-T28
Number of terminals	28
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum read time	32 s
Maximum slew rate	30 mA
surface mount	NO
technology	CMOS
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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ISD2532/40/48/64

SINGLE-CHIP, MULTIPLE-MESSAGES,

VOICE RECORD/PLAYBACK DEVICE

32-, 40-, 48-, AND 64-SECOND DURATION

-1-

Publication Release Date: June 2003

Revision 1.0

ISD2532/40/48/64

4. TABLE OF CONTENTS

1. GENERAL DESCRIPTION.................................................................................................................. 2

2. FEATURES ......................................................................................................................................... 2

3. BLOCK DIAGRAM .............................................................................................................................. 3

4. TABLE OF CONTENTS ...................................................................................................................... 4

5. PIN CONFIGURATION ....................................................................................................................... 5

6. PIN DESCRIPTION ............................................................................................................................. 6

7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10

7.1. Detailed Description.................................................................................................................... 10

7.2. Operational Modes ..................................................................................................................... 11

7.2.1. Operational Modes Description............................................................................................ 12

8. TIMING DIAGRAMS.......................................................................................................................... 16

9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 19

9.1 Operating Conditions ................................................................................................................... 20

10. ELECTRICAL CHARACTERISTICS ............................................................................................... 21

10.1. Parameters For Packaged Parts .............................................................................................. 21

10.1.1. Typical Parameter Variation with Voltage and Temperature - Packaged Parts ................ 24

10.2. Parameters For Die .................................................................................................................. 25

10.2.1. Typical Parameter Variation with Voltage and Temperature - Die .................................... 28

10.3. Parameters For Push-Button Mode.......................................................................................... 29

11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 30

12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 35

12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 35

12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................... 36

12.3. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 ................................ 37

12.4. Die Bonding Physical Layout

[1]

................................................................................................ 38

14. VERSION HISTORY ....................................................................................................................... 41

-4-

ISD2532PI Related Products

	ISD2532PI	ISD2540PI	ISD2540SI	ISD2532EI	ISD2532SI
Description	Speech Synthesizer With RCDG, 32s, CMOS, PDIP28	Speech Synthesizer With RCDG, 40s, CMOS, PDIP28,	Speech Synthesizer With RCDG, 40s, CMOS, PDSO28,	Speech Synthesizer With RCDG, 32s, CMOS, PDSO28	Speech Synthesizer With RCDG, 32s, CMOS, PDSO28
Maker	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation
package instruction	DIP, DIP28,.6	DIP, DIP28,.6	SOP, SOP28,.4	TSSOP, TSSOP28,.53,22	SOP, SOP28,.4
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-PDIP-T28	R-PDIP-T28	R-PDSO-G28	R-PDSO-G28	R-PDSO-G28
Number of terminals	28	28	28	28	28
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP	TSSOP	SOP
Encapsulate equivalent code	DIP28,.6	DIP28,.6	SOP28,.4	TSSOP28,.53,22	SOP28,.4
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE
power supply	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum read time	32 s	40 s	40 s	32 s	32 s
Maximum slew rate	30 mA	30 mA	30 mA	30 mA	30 mA
surface mount	NO	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	GULL WING
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	0.55 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL

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