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MC54HC10JS

Description
IC,LOGIC GATE,3 3-INPUT NAND,HC-CMOS,DIP,14PIN,CERAMIC
Categorylogic    logic   
File Size311KB,5 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MC54HC10JS Overview

IC,LOGIC GATE,3 3-INPUT NAND,HC-CMOS,DIP,14PIN,CERAMIC

MC54HC10JS Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNXP
package instructionDIP, DIP14,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T14
JESD-609 codee0
Logic integrated circuit typeNAND GATE
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply2/6 V
Certification statusNot Qualified
Schmitt triggerNO
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

MC54HC10JS Related Products

MC54HC10JS 54HC10M/B2AJC MC74HC10ADT MC74HC10AN
Description IC,LOGIC GATE,3 3-INPUT NAND,HC-CMOS,DIP,14PIN,CERAMIC IC,LOGIC GATE,3 3-INPUT NAND,HC-CMOS,LLCC,20PIN,CERAMIC IC,LOGIC GATE,3 3-INPUT NAND,HC-CMOS,TSSOP,14PIN,PLASTIC IC,LOGIC GATE,3 3-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker NXP NXP NXP NXP
package instruction DIP, DIP14,.3 QCCN, LCC20,.35SQ TSSOP, TSSOP14,.25 DIP, DIP14,.3
Reach Compliance Code unknown unknown unknown unknown
JESD-30 code R-XDIP-T14 S-XQCC-N20 R-PDSO-G14 R-PDIP-T14
JESD-609 code e0 e0 e0 e0
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE
Number of terminals 14 20 14 14
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C
Package body material CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP QCCN TSSOP DIP
Encapsulate equivalent code DIP14,.3 LCC20,.35SQ TSSOP14,.25 DIP14,.3
Package shape RECTANGULAR SQUARE RECTANGULAR RECTANGULAR
Package form IN-LINE CHIP CARRIER SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
power supply 2/6 V 2/6 V 2/6 V 2/6 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO
surface mount NO YES YES NO
technology CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE NO LEAD GULL WING THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 0.635 mm 2.54 mm
Terminal location DUAL QUAD DUAL DUAL
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