IC,LOGIC GATE,3 3-INPUT NAND,HC-CMOS,DIP,14PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | NAND GATE |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 2/6 V |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| MC54HC10JS | 54HC10M/B2AJC | MC74HC10ADT | MC74HC10AN | |
|---|---|---|---|---|
| Description | IC,LOGIC GATE,3 3-INPUT NAND,HC-CMOS,DIP,14PIN,CERAMIC | IC,LOGIC GATE,3 3-INPUT NAND,HC-CMOS,LLCC,20PIN,CERAMIC | IC,LOGIC GATE,3 3-INPUT NAND,HC-CMOS,TSSOP,14PIN,PLASTIC | IC,LOGIC GATE,3 3-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | NXP | NXP | NXP | NXP |
| package instruction | DIP, DIP14,.3 | QCCN, LCC20,.35SQ | TSSOP, TSSOP14,.25 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T14 | S-XQCC-N20 | R-PDSO-G14 | R-PDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| Number of terminals | 14 | 20 | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | QCCN | TSSOP | DIP |
| Encapsulate equivalent code | DIP14,.3 | LCC20,.35SQ | TSSOP14,.25 | DIP14,.3 |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE |
| power supply | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO |
| surface mount | NO | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | NO LEAD | GULL WING | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 0.635 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | DUAL | DUAL |