F-219
MEC1–130–02–L–D–EM2
MEC1–120–02–F–D–EM2
MEC1–120–02–L–D–RA1–SL
(1.00 mm) .0394"
MEC1-RA, MEC1-EM SERIES
RIGHT-ANGLE/EDGE MOUNT SOCKETS
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MEC1-RA
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
1.6 A per pin
(2 adjacent pins powered)
Operating Temp Range:
-55 °C to +125 °C
Insertion Depth:
(5.84 mm) .230" to (8.13 mm) .320"
RoHS Compliant:
Yes
MEC1
Mates with:
(1.60 mm)
.062" card
1
POSITIONS
PER ROW
CARD
SLOT
PLATING
OPTION
D
RA1
NP
–NP
SL
05, 08, 20, 30,
40, 50, 60, 70
= (1.60 mm)
.062"
thick card
– 02
= Gold flash
on contact,
Matte Tin
on tail
–F
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (05-40)
(0.15 mm) .006" max (50-70)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
(8.89)
.350
(No. of Positions + 2) x
(1.00) .03937 + (2.54) .100
(0.36) .014
02
(11.68) (11.96)
.460
.471
= 10 µ"
(0.25 µm)
Gold on
contact,
Matte Tin
on tail
(8.13)
.320
–L
POSITIONS POLARIZED
PER ROW
POSITIONS
3, 4
05
5, 6
08
15, 16
20
21, 22
30
31, 32
40
41, 42
50
31, 32, 63 & 64
60
53, 54, 115 & 116
70
= No Polarization
(8 positions only)
Leave Blank for
polarization
(6.81)
.268
01
Note:
While optimized for 50
W
applications, this connector with
(MOQ Required)
alternative signal/ground patterns
• Elevated body
may also perform well in certain
height
75
W
applications.
• Other platings
ALSO
AVAILABLE
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
(1.52)
.060
(1.00)
.03937
(No. of Positions + 2)
x (1.00) .03937
(1.78)
.070
DIA
(0.91)
.036
(2.51) (0.91)
.036
.099
HIGH-SPEED CHANNEL PERFORMANCE
MEC1-RA
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
APPLICATION
Samtec recommends that pads
on the mating board be Gold plated.
14
G b p s
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MEC1-EM
MEC1
1
POSITIONS
PER ROW
02
PLATING
OPTION
D
EM2
NP
Insulator Material:
Mates with:
Black LCP
(1.60 mm)
Contact Material:
Phosphor Bronze
.062" card
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
ALSO
1.8 A per pin
(2 adjacent pins powered)
AVAILABLE
Operating
(MOQ Required)
Temp Range:
-55 °C to +125 °C
• Edge mount leads
Insertion Depth:
for (0.80 mm) .031"
(5.84 mm) .230" to
thick board
(8.13 mm) .320"
• Other platings
RoHS Compliant:
Yes
Lead–Free Solderable:
Yes
05, 08, 20, 30,
40, 50, 60, 70
(No. of Positions + 2) x
(1.00) .03937 + (12.45) .490
02
= Gold flash on contact,
Matte Tin on tail
–F
–L
= No Polarization
(8 positions only)
Leave Blank for
polarization
–NP
= 10 µ" (0.25 µm) Gold on contact,
Matte Tin on tail
Note:
While optimized for 50
W
applications,
this connector with alternative signal/ground
patterns may also perform well in certain
75
W
applications.
(8.13)
.320
(5.21)
.205
(6.81)
.268
01
(No. of Positions + 2)
x (1.00) .03937
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
(8.89)
.350
(4.70)
.185
(4.57)
.180
(3.15)
.124 (1.00)
.03937
(0.36)
.014
Note:
Some sizes,
styles and options
are non-standard,
non-returnable.
(1.19) ± (0.38)
.047
.015
POSITIONS POLARIZED
PER ROW POSITIONS
3, 4
05
5, 6
08
15, 16
20
21, 22
30
31, 32
40
41, 42
50
31, 32, 63
60
& 64
53, 54, 115
70
& 116
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
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