|
TLK3101IRCPG4 |
TLK3101IRCP |
| Description |
Ethernet ICs 2.5 to 3.125 Gbps Transceiver |
Ethernet ICs 2.5 to 3.125 Gbps Transceiver |
| Brand Name |
Texas Instruments |
Texas Instruments |
| Is it lead-free? |
Lead free |
Lead free |
| Is it Rohs certified? |
conform to |
conform to |
| Maker |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
QFP |
QFP |
| package instruction |
HVFQFP, |
HVFQFP, |
| Contacts |
64 |
64 |
| Reach Compliance Code |
compli |
compli |
| ECCN code |
EAR99 |
EAR99 |
| Differential output |
YES |
YES |
| Number of drives |
1 |
1 |
| Input properties |
DIFFERENTIAL |
DIFFERENTIAL |
| Interface integrated circuit type |
LINE TRANSCEIVER |
LINE TRANSCEIVER |
| Interface standards |
GENERAL PURPOSE |
GENERAL PURPOSE |
| JESD-30 code |
S-PQFP-G64 |
S-PQFP-G64 |
| JESD-609 code |
e4 |
e4 |
| length |
10 mm |
10 mm |
| Humidity sensitivity level |
3 |
3 |
| Number of functions |
1 |
1 |
| Number of terminals |
64 |
64 |
| Maximum operating temperature |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
HVFQFP |
HVFQFP |
| Package shape |
SQUARE |
SQUARE |
| Package form |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
| Certification status |
Not Qualified |
Not Qualified |
| Number of receiver bits |
1 |
1 |
| Maximum seat height |
1 mm |
1 mm |
| Maximum supply voltage |
2.7 V |
2.7 V |
| Minimum supply voltage |
2.3 V |
2.3 V |
| Nominal supply voltage |
2.5 V |
2.5 V |
| surface mount |
YES |
YES |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form |
GULL WING |
GULL WING |
| Terminal pitch |
0.5 mm |
0.5 mm |
| Terminal location |
QUAD |
QUAD |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
10 mm |
10 mm |