LM346J datasheet, PDF - EEWORLD Datasheet

LM346J: DescriptionLM346J; CategoryAnalog mixed-signal IC Amplifier circuit; File Size663KB，12 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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LM346J Overview

LM346J

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
package instruction	DIP, DIP16,.3
Reach Compliance Code	not_compliant
Amplifier type	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK
frequency compensation	YES
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
low-dissonance	NO
micropower	YES
Number of functions	4
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	+-1.5/+-15 V
Programmable power	YES
Certification status	Not Qualified
Nominal slew rate	0.4 V/us
surface mount	NO
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	LM346J	LM346N
Description	LM346J	LM346N
Is it Rohs certified?	incompatible	incompatible
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation
package instruction	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	not_compliant	not_compliant
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK
frequency compensation	YES	YES
JESD-30 code	R-XDIP-T16	R-PDIP-T16
JESD-609 code	e0	e0
low-dissonance	NO	NO
micropower	YES	YES
Number of functions	4	4
Number of terminals	16	16
Maximum operating temperature	70 °C	70 °C
Package body material	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE
power supply	+-1.5/+-15 V	+-1.5/+-15 V
Programmable power	YES	YES
Certification status	Not Qualified	Not Qualified
Nominal slew rate	0.4 V/us	0.4 V/us
surface mount	NO	NO
technology	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL

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