Bulletin I0511J rev. C 03/07
SC175.....5. Series
SCHOTTKY DIE 175 x 175 mils
40 (157)
Wafer flat alligned with
side b of the die
a
c
0.35 ± 0.01
(14 ± 0.4)
D
b
d
C
A
NOTES:
Ø
1. ALL DIMENSIONS ARE SHOWN IN
MILLIMETERS (MILS)
2. CONTROLLING DIMENSION: (MILS)
3. LETTER DESIGNATION:
A = Anode (Top Metal)
C = Cathode (Back Metal)
D = Reject Ink Dot (only on non-conforming dies)
4. SAWING:
Recommended Blade
SEMITEC S1025 QS00 Blade
Sawing Street
0.05 ± 0.005
(2 ± 0.2)
Ø 125 (492)
NOT TO SCALE
5. DIMENSIONS AND TOLERANCES
Device
#
SC175
R
015x5x
SC175
S
020x5x
SC175
S
030x5x
SC175
S
045x5x
SC175
S
060x5x
SC175
H
045x5x
SC175
H
100x5x
SC175
H
150x5x
T
J
Max.
(°C)
125
150
150
150
150
175
175
175
V
R
(V)
15
20
30
45
60
45
100
150
A
B
C
D
diameter
n.a. contact factory
n.a. contact factory
n.a. contact factory
4.44 + 0, -0.01
(175 + 0, -0.4)
4.44 + 0, -0.01
(175 + 0, -0.4)
4.44 + 0, -0.01
(175 + 0, -0.4)
4.44 + 0, -0.01
(175 + 0, -0.4)
4.19 + 0, -0.01
(165 + 0, -0.4)
4.19 + 0, -0.01
(165 + 0, -0.4)
4.19 + 0, -0.01
(165 + 0, -0.4)
4.19 + 0, -0.01
(165 + 0, -0.4)
1 ± 0.15
40 ± 0.2
1 ± 0.15
40 ± 0.2
n.a. contact factory
4.44 + 0, -0.01 4.44 + 0, -0.01 4.19 + 0, -0.01 4.19 + 0, -0.01
(175 + 0, -0.4) (175 + 0, -0.4) (165 + 0, -0.4) (165 + 0, -0.4)
n.a. contact factory
1 ± 0.15
40 ± 0.2
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1
SC175.....5. Series
Bulletin I0511J rev. C 03/07
Electrical Characteristics
Device
#
SC175
R
015x5x
SC175
S
020x5x
SC175
S
030x5x
SC175
S
045x5x
SC175
S
060x5x
SC175
H
045x5x
SC175
H
100x5x
SC175
H
150x5x
T
J
Max.
(°C)
125
150
150
150
150
175
175
175
V
R
(V)
15
20
30
45
60
45
100
150
300
250
40
20
Typ. I
R
@ 25°C
(μA)
Typ. I
R
@ 125°C
(mA)
Max. V
F
@ I
F
(V)
Package
Style
n.a. contact factory
n.a. contact factory
n.a. contact factory
145
130
35
13
0.49 @ 20A
0.53 @ 20A
0.64 @ 30A
0.77 @ 20A
TO-247
TO-247
DO-4
TO-247
n.a. contact factory
Mechanical Data
Device
#
SC175xxxx
A
5x
SC175xxxx
S
5x
Bondable
Solderable
--
Ti 2 kÅ
Metal Thickness
Front Metal
Al (1% Si) 30 kÅ
Ni 1 kÅ
--
Ag 35 kÅ
Cr 1 kÅ
Cr 1 kÅ
Metal Thickness
Back Metal
Ni 2 kÅ
Ni 2 kÅ
Ag 3 kÅ
Ag 3 kÅ
Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination.
Shelf life for parts stored in above condition is 2 years.
If the storage is done in normal atmosphere shelf life is reduced to six months.
Packaging
Device
#
SC175xxxxx5
B
SC175xxxxx5
R
SC175xxxxx5
P
SC175xxxxx5
F
Description
Minimum Order Quantity
Die in Sale Package
500
n.a.
500
500
Inked Probed Unsawn Wafer (Wafer in Box)
Probed Die in Tape & Reel
Probed Die in Waffle Pack
Inked Probed Sawn Wafer on Film
2
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SC175.....5. Series
Bulletin I0511J rev. C 03/07
Ordering Information Table
Device Code
SC 175
1
2
H
3
100
4
A
5
5
6
B
7
1
2
3
4
5
6
7
-
-
-
-
-
-
-
Schottky Die
Chip Dimension in Mils (125 x 125)
Process (see Electrical Characteristics Table)
Voltage code: Code = V
RRM
Chip surface metallization (Al)
Wafer Diameter in inches
Packaging (B = inked Probed Unsawn Wafers)
H = 830 Process
R = OR' ing Process
S = Standard Process
Wafer on Film
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3
SC175.....5. Series
Bulletin I0511J rev. C 03/07
Wafer in Box
ROUND CONTAINER
TYVEK DISK
FOAM DISK
Die in Waffle Pack
CHIP TRAY POCKET
4
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SC175.....5. Series
Bulletin I0511J rev. C 03/07
Data and specifications subject to change without notice.
This product has been designed for Industrial Level.
Qualification Standards can be found on IR's Web site.
IR WORLD HEADQUARTERS:
233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7309
Visit us at www.irf.com for sales contact information. 03/07
www.irf.com
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