|
TMS320C6455BCTZ8 |
TMS320C6455BCTZ7 |
| Description |
Fixed-Point Digital Signal Processor 697-FCBGA 0 to 90 |
Fixed-Point Digital Signal Processor 697-FCBGA 0 to 90 |
| Brand Name |
Texas Instruments |
Texas Instruments |
| Is it lead-free? |
Lead free |
Lead free |
| Is it Rohs certified? |
conform to |
conform to |
| Maker |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
BGA |
BGA |
| package instruction |
HBGA, |
HBGA, |
| Contacts |
697 |
697 |
| Reach Compliance Code |
compli |
compli |
| ECCN code |
3A991A2 |
3A991A2 |
| Factory Lead Time |
26 weeks |
6 weeks |
| barrel shifter |
NO |
NO |
| boundary scan |
YES |
YES |
| maximum clock frequency |
66.6 MHz |
66.6 MHz |
| Format |
FIXED POINT |
FIXED POINT |
| Internal bus architecture |
MULTIPLE |
MULTIPLE |
| JESD-30 code |
S-PBGA-B697 |
S-PBGA-B697 |
| JESD-609 code |
e1 |
e1 |
| length |
24 mm |
24 mm |
| low power mode |
YES |
YES |
| Humidity sensitivity level |
4 |
4 |
| Number of terminals |
697 |
697 |
| Maximum operating temperature |
90 °C |
90 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
HBGA |
HBGA |
| Package shape |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY, HEAT SINK/SLUG |
GRID ARRAY, HEAT SINK/SLUG |
| Peak Reflow Temperature (Celsius) |
245 |
245 |
| Maximum seat height |
3.242 mm |
3.242 mm |
| Maximum supply voltage |
1.236 V |
1.236 V |
| Minimum supply voltage |
1.164 V |
1.164 V |
| Nominal supply voltage |
1.2 V |
1.2 V |
| surface mount |
YES |
YES |
| technology |
CMOS |
CMOS |
| Temperature level |
OTHER |
OTHER |
| Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form |
BALL |
BALL |
| Terminal pitch |
0.8 mm |
0.8 mm |
| Terminal location |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
24 mm |
24 mm |
| uPs/uCs/peripheral integrated circuit type |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches |
1 |
1 |