Buffer Amplifier, 1 Func, CDFP10, HERMETIC SEALED, FP-10
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Parts packaging code | DFP |
| package instruction | DFP, FL10,.3 |
| Contacts | 10 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Amplifier type | BUFFER |
| Maximum average bias current (IIB) | 0.01 µA |
| Nominal bandwidth (3dB) | 20 MHz |
| Maximum input offset voltage | 10000 µV |
| JESD-30 code | R-CDFP-F10 |
| JESD-609 code | e0 |
| Negative supply voltage upper limit | -18 V |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| Number of functions | 1 |
| Number of terminals | 10 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL10,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | +-15 V |
| Certification status | Not Qualified |
| Maximum seat height | 2.032 mm |
| Nominal slew rate | 30 V/us |
| Supply voltage upper limit | 18 V |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | YES |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
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