|
LM8805TLE/NOPB |
LM8805TLX-3.0/NOPB |
LM8805TLX/NOPB |
LM8805TLE-3.0/NOPB |
| Description |
IC 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PBGA9, LEAD FREE, MICRO, SMD-9, Power Management Circuit |
IC 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PBGA9, LEAD FREE, MICRO SMD-9, Power Management Circuit |
IC 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PBGA9, LEAD FREE, MICRO SMD-9, Power Management Circuit |
IC 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PBGA9, LEAD FREE, MICRO SMD-9, Power Management Circuit |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
| package instruction |
FBGA, BGA9,3X3,20 |
FBGA, BGA9,3X3,20 |
FBGA, BGA9,3X3,20 |
FBGA, BGA9,3X3,20 |
| Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Other features |
RESET THRESHOLD VOLTAGE IS 2.3V |
RESET THRESHOLD VOLTAGE IS 2.3V |
RESET THRESHOLD VOLTAGE IS 2.3V |
RESET THRESHOLD VOLTAGE IS 2.3V |
| Adjustable threshold |
NO |
NO |
NO |
NO |
| Analog Integrated Circuits - Other Types |
POWER SUPPLY MANAGEMENT CIRCUIT |
POWER SUPPLY MANAGEMENT CIRCUIT |
POWER SUPPLY MANAGEMENT CIRCUIT |
POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 code |
S-PBGA-B9 |
S-PBGA-B9 |
S-PBGA-B9 |
S-PBGA-B9 |
| JESD-609 code |
e1 |
e1 |
e1 |
e1 |
| length |
1.46 mm |
1.46 mm |
1.46 mm |
1.46 mm |
| Humidity sensitivity level |
1 |
1 |
1 |
1 |
| Number of channels |
1 |
1 |
1 |
1 |
| Number of functions |
1 |
1 |
1 |
1 |
| Number of terminals |
9 |
9 |
9 |
9 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
FBGA |
FBGA |
FBGA |
FBGA |
| Encapsulate equivalent code |
BGA9,3X3,20 |
BGA9,3X3,20 |
BGA9,3X3,20 |
BGA9,3X3,20 |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY, FINE PITCH |
GRID ARRAY, FINE PITCH |
GRID ARRAY, FINE PITCH |
GRID ARRAY, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
| power supply |
2.5/5 V |
2.5/5 V |
2.5/5 V |
2.5/5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum supply current (Isup) |
0.05 mA |
0.05 mA |
0.05 mA |
0.05 mA |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
1 V |
1 V |
1 V |
1 V |
| surface mount |
YES |
YES |
YES |
YES |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form |
BALL |
BALL |
BALL |
BALL |
| Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
| Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
1.46 mm |
1.46 mm |
1.46 mm |
1.46 mm |
| Maker |
National Semiconductor(TI ) |
- |
National Semiconductor(TI ) |
National Semiconductor(TI ) |