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THS6022
250-mA DUAL DIFFERENTIAL LINE DRIVER
SLOS225C – SEPTEMBER 1998 – REVISED JANUARY 2000
D
D
D
D
D
D
D
D
ADSL, HDSL and VDSL Diff. Line Driver
200 mA Output Current Minimum Into 50-Ω
Load
High Speed
– 210 MHz Bandwidth (–3dB) at 50-Ω Load
– 300 MHz Bandwidth (–3dB) at 100-Ω Load
– 1900 V/µs Slew Rate, G = 5
Low Distortion
– –69 dB 3rd Order Harmonic Distortion at
f = 1 MHz, 50-Ω Load, and V
O(PP)
= 20 V
Independent Power Supplies for Low
Crosstalk
Wide Supply Range
±
5 V to
±15
V
Thermal Shutdown and Short Circuit
Protection
Evaluation Module Available
Thermally Enchanced TSSOP (PWP)
PowerPAD™ Package
(TOP VIEW)
V
CC
–
1OUT
V
CC+
1IN+
1IN–
NC
NC
1
2
3
4
5
6
7
14
13
12
11
10
9
8
V
CC
–
2OUT
V
CC+
2IN+
2IN–
NC
NC
NC – No internal connection
(SIDE VIEW)
Cross Section View Showing PowerPAD
† This terminal is internally connected to the thermal pad.
MicroStar™ Junior (GQE) Package
(TOP VIEW)
description
The THS6022 contains two high-speed drivers
capable of providing 200 mA output current (min)
into a 50-Ω load. These drivers can be configured
differentially to drive a 50-V p-p output signal over
low-impedance lines. The drivers are current
feedback amplifiers, designed for the high slew
rates necessary to support low total harmonic
(SIDE VIEW)
distortion (THD) in xDSL applications. The
THS6022 is ideally suited for asymmetrical digital
subscriber line (ADSL) at the remote terminal, high data rate digital suscriber line (HDSL), and very high data
rate digital suscriber line (VDSL), where it supports the high-peak voltage and current requirements of these
applications. Separate power supply connections for each driver are provided to minimize crosstalk.
HIGH-SPEED xDSL LINE DRIVER/RECEIVER FAMILY
DEVICE
THS6002
THS6012
THS6022
THS6032
THS6062
THS7002
DRIVER
RECEIVER
DESCRIPTION
Dual differential line drivers and receivers
500-mA dual differential line driver
250-mA dual differential line driver
Low-power ADSL central office line driver
•
•
•
•
•
•
•
Low-noise ADSL receiver
Low-noise programmable gain ADSL receiver
CAUTION: The THS6022 provides ESD protection circuitry. However, permanent damage can still occur if this device is subjected
to high-energy electrostatic discharges. Proper ESD precautions are recommended to avoid any performance degradation or loss
of functionality.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
©
2000, Texas Instruments Incorporated
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
1
THS6022
250-mA DUAL DIFFERENTIAL LINE DRIVER
SLOS225C – SEPTEMBER 1998 – REVISED JANUARY 2000
description (continued)
The THS6022 is packaged in the patented PowerPAD package. This package provides outstanding thermal
characteristics in a small footprint package, which is fully compatible with automated surface-mount assembly
procedures. The exposed thermal pad on the underside of the package is in direct contact with the die. By simply
soldering the pad to the PWB copper and using other thermal outlets, the heat is conducted away from the
junction.
AVAILABLE OPTIONS
PACKAGED DEVICE
TA
PowerPAD PLASTIC
SMALL OUTLINE†
(PWP)
THS6022CPWP
MicroStar Junior
(GQE)
THS6022CGQE
EVALUATION
MODULE
THS6022EVM
0°C to 70°C
– 40°C to 85°C
THS6022IPWP
THS6022IGQE
—
† The PWP packages are available taped and reeled. Add an R suffix to the device type (i.e.,
THS6022CPWPR)
Terminal Functions
TERMINAL
NAME
1OUT
1IN–
1IN+
2OUT
2IN–
2IN+
VCC+
VCC–
NC
PWP PACKAGE
TERMINAL NO.
2
5
4
13
10
11
3, 12
1, 14
6, 7, 8 ,9
GQE PACKAGE
TERMINAL NO.
A3
F1
D1
A7
F9
D9
B1, B9
A4, A6
NA
2
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
THS6022
250-mA DUAL DIFFERENTIAL LINE DRIVER
SLOS225C – SEPTEMBER 1998 – REVISED JANUARY 2000
pin assignments
MicroStar
™
Junior (GQE) Package
(TOP VIEW)
V CC–
V CC–
5
NC
6
1OUT
2OUT
7
1
A
NC
2
NC
3
4
8
NC
9
NC
VCC+
B
NC
NC
NC
NC
NC
NC
NC
VCC+
NC
C
NC
NC
NC
NC
NC
NC
NC
1N+
D
NC
NC
NC
NC
NC
NC
NC
2IN+
NC
E
NC
NC
NC
NC
NC
NC
NC
NC
F
1IN–
G
NC
NC
NC
NC
NC
NC
NC
NC
2IN–
NC
NC
NC
NC
NC
NC
NC
NC
H
NC
NC
NC
NC
NC
NC
NC
NC
NC
J
NC
NC
NC
NC
NC
NC
NC
NC
NC
NOTE: Shaded terminals are used for thermal connection to the ground plane.
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
3
THS6022
250-mA DUAL DIFFERENTIAL LINE DRIVER
SLOS225C – SEPTEMBER 1998 – REVISED JANUARY 2000
functional block diagram
Driver 1
3 V +
CC
1 IN+
4
+
2
1 IN–
5
_
1
Driver 2
2 IN+
11
10
+
13
2 IN–
_
14
VCC–
2 OUT
12
VCC–
VCC+
1OUT
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
†
Supply voltage, V
CC+
to V
CC–
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 V
Input voltage, V
I
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
V
CC
Output current, I
O
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA
Differential input voltage, V
ID
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Continuous total power dissipation at (or below) T
A
= 25°C (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 W
Operating free air temperature, T
A
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C
Storage temperature, T
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 125°C
Lead temperature, 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The THS6022 incorporates a PowerPad on the underside of the chip. This acts as a heatsink and must be connected to a thermal
dissipation plane for proper power dissipation. Failure to do so can result in exceeding the maximum junction temperature, which could
permanently damage the device. See the
Thermal Information
section of this document for more information about PowerPad
technology.
recommended operating conditions
MIN
Supply voltage VCC+ and VCC –
voltage, CC
O erating
Operating free-air tem erature, TA
temperature
Split supply
Single supply
C Suffix
I Suffix
±
4.5
9
0
– 40
NOM
MAX
±
16
32
70
85
UNIT
V
°C
4
POST OFFICE BOX 655303
•
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