|
PCI2060ZHK |
PCI2060GHK |
PCI2060IGHK |
| Description |
Asynchronous, 32-Bit, 66 MHz PCI-to-PCI Bridge, Compact PCI Hot-Swap Friendly, 9-Master 257-BGA MICROSTAR |
PCI Interface IC Async 32-Bit 66MHz PCI-to-PCI Bridge |
Asynchronous, 32-Bit, 66 MHz PCI-to-PCI Bridge, Compact PCI Hot-Swap Friendly, 9-Master 257-BGA MICROSTAR -40 to 85 |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it Rohs certified? |
conform to |
incompatible |
incompatible |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
BGA |
BGA |
BGA |
| package instruction |
LFBGA, |
LFBGA, BGA257,19X19,32 |
LFBGA, BGA257,19X19,32 |
| Contacts |
257 |
257 |
257 |
| Reach Compliance Code |
compli |
_compli |
_compli |
| ECCN code |
EAR99 |
3A001.A.3 |
3A001.A.3 |
| Address bus width |
32 |
32 |
32 |
| maximum clock frequency |
66 MHz |
66 MHz |
66 MHz |
| External data bus width |
32 |
32 |
32 |
| JESD-30 code |
S-PBGA-B257 |
S-PBGA-B257 |
S-PBGA-B257 |
| JESD-609 code |
e1 |
e0 |
e0 |
| length |
16 mm |
16 mm |
16 mm |
| Humidity sensitivity level |
3 |
3 |
3 |
| Number of terminals |
257 |
257 |
257 |
| Maximum operating temperature |
70 °C |
70 °C |
85 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
LFBGA |
LFBGA |
LFBGA |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
220 |
220 |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
1.4 mm |
1.4 mm |
1.4 mm |
| Maximum supply voltage |
3.6 V |
3.6 V |
3.6 V |
| Minimum supply voltage |
3 V |
3 V |
3 V |
| Nominal supply voltage |
3.3 V |
3.3 V |
3.3 V |
| surface mount |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
COMMERCIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
BALL |
BALL |
BALL |
| Terminal pitch |
0.8 mm |
0.8 mm |
0.8 mm |
| Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
16 mm |
16 mm |
16 mm |
| uPs/uCs/peripheral integrated circuit type |
BUS CONTROLLER, PCI |
BUS CONTROLLER, PCI |
BUS CONTROLLER, PCI |
| Factory Lead Time |
1 week |
1 week |
- |
| Encapsulate equivalent code |
- |
BGA257,19X19,32 |
BGA257,19X19,32 |
| power supply |
- |
3.3,3.3/5 V |
3.3,3.3/5 V |