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74VHC153MSC

Description
IC,LOGIC MUX,DUAL,4-INPUT,AHC/VHC-CMOS,SSOP,16PIN,PLASTIC
Categorylogic    logic   
File Size224KB,4 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric Compare

74VHC153MSC Overview

IC,LOGIC MUX,DUAL,4-INPUT,AHC/VHC-CMOS,SSOP,16PIN,PLASTIC

74VHC153MSC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
Reach Compliance Codecompliant
JESD-30 codeR-PDSO-G16
JESD-609 codee0
Load capacitance (CL)50 pF
Logic integrated circuit typeMULTIPLEXER
MaximumI(ol)0.008 A
Number of functions2
Number of entries4
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Encapsulate equivalent codeSSOP16,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
power supply2/5.5 V
Prop。Delay @ Nom-Sup11 ns
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationDUAL

74VHC153MSC Related Products

74VHC153MSC
Description IC,LOGIC MUX,DUAL,4-INPUT,AHC/VHC-CMOS,SSOP,16PIN,PLASTIC
Is it Rohs certified? incompatible
Maker National Semiconductor(TI )
Reach Compliance Code compliant
JESD-30 code R-PDSO-G16
JESD-609 code e0
Load capacitance (CL) 50 pF
Logic integrated circuit type MULTIPLEXER
MaximumI(ol) 0.008 A
Number of functions 2
Number of entries 4
Number of terminals 16
Maximum operating temperature 85 °C
Minimum operating temperature -40 °C
Package body material PLASTIC/EPOXY
encapsulated code SSOP
Encapsulate equivalent code SSOP16,.25
Package shape RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH
power supply 2/5.5 V
Prop。Delay @ Nom-Sup 11 ns
Certification status Not Qualified
surface mount YES
technology CMOS
Temperature level INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb)
Terminal form GULL WING
Terminal pitch 0.635 mm
Terminal location DUAL
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