Important notice
Dear Customer,
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use
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reserved
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-
© Nexperia B.V. (year). All rights reserved.
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NXP Semiconductors
Product data sheet
Low-voltage stabistor
FEATURES
•
Low-voltage stabilization
•
Forward voltage range: 580 to 960 mV
•
Total power dissipation: max. 250 mW.
APPLICATIONS
•
Low-voltage stabilization e.g.
– Bias stabilizer in class-B output stages
– Clipping
– Clamping
– Meter protection.
DESCRIPTION
Low-voltage stabilization diode in a small SOT23 plastic
package.
MARKING
TYPE NUMBER
BAS17
Note
1.
∗
= p : Made in Hong Kong.
∗
= t : Made in Malaysia.
∗
= W : Made in China.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
V
R
I
F
P
tot
T
stg
T
j
PARAMETER
continuous reverse voltage
continuous forward current
total power dissipation
storage temperature
junction temperature
T
amb
= 25
°C
CONDITIONS
−
−
−
−65
−
MIN.
5
200
250
+150
150
MARKING CODE
(1)
∗A9
Fig.1
3
2
n.c.
handbook, halfpage
2
BAS17
PINNING
PIN
1
2
3
anode
not connected
cathode
DESCRIPTION
1
1
3
MAM185
Simplified outline (SOT23),
pin configuration and symbol.
MAX.
V
UNIT
mA
mW
°C
°C
2003 Mar 25
2
NXP Semiconductors
Product data sheet
Low-voltage stabistor
ELECTRICAL CHARACTERISTICS
T
j
= 25
°C
unless otherwise specified.
SYMBOL
V
F
PARAMETER
forward voltage
CONDITIONS
see Fig.2
I
F
= 0.1 mA
I
F
= 1 mA
I
F
= 5 mA
I
F
= 10 mA
I
F
= 100 mA
I
R
r
dif
S
F
C
d
reverse current
differential resistance
temperature coefficient
diode capacitance
V
R
= 4 V
I
F
= 0.5 mA
I
F
= 2 mA
I
F
= 1 mA
V
R
= 0 V; f = 1 MHz
580
665
725
750
870
−
−
−
−
−
−
−
−
−
−
−
120
80
−1.8
−
MIN.
TYP.
BAS17
MAX.
660
745
805
830
960
5
−
−
−
140
UNIT
mV
mV
mV
mV
mV
µA
Ω
Ω
mV/K
pF
THERMAL CHARACTERISTICS
SYMBOL
R
th j-tp
R
th j-a
Note
1. Device mounted on a FR4 printed-circuit board.
PARAMETER
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
note 1
CONDITIONS
VALUE
330
500
UNIT
K/W
K/W
2003 Mar 25
3