SRAM Module, 1MX8, 15ns, CMOS,
| Parameter Name | Attribute value |
| Maker | EDI [Electronic devices inc.] |
| Reach Compliance Code | unknown |
| Maximum access time | 15 ns |
| Other features | CONFIGURABLE AS 256K X 32 |
| Spare memory width | 16 |
| JESD-30 code | R-XSMA-N64 |
| memory density | 8388608 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 8 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 64 |
| word count | 1048576 words |
| character code | 1000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1MX8 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | UNSPECIFIED |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal location | SINGLE |
| EDI8F32256C15MMC-G | EDI8F32256C20MMC-G | EDI8F32256C35MMC-G | EDI8F32256C15MNC-G | EDI8F32256C25MMC-G | |
|---|---|---|---|---|---|
| Description | SRAM Module, 1MX8, 15ns, CMOS, | SRAM Module, 1MX8, 20ns, CMOS, | SRAM Module, 1MX8, 35ns, CMOS, | SRAM Module, 1MX8, 15ns, CMOS, | SRAM Module, 1MX8, 25ns, CMOS, |
| Maker | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 15 ns | 20 ns | 35 ns | 15 ns | 25 ns |
| Other features | CONFIGURABLE AS 256K X 32 | CONFIGURABLE AS 256K X 32 | CONFIGURABLE AS 256K X 32 | CONFIGURABLE AS 256K X 32 | CONFIGURABLE AS 256K X 32 |
| Spare memory width | 16 | 16 | 16 | 16 | 16 |
| JESD-30 code | R-XSMA-N64 | R-XSMA-N64 | R-XSMA-N64 | R-XSMA-N64 | R-XSMA-N64 |
| memory density | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
| Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| memory width | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 64 | 64 | 64 | 64 | 64 |
| word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| character code | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | YES | YES | YES | YES | YES |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| Terminal location | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |