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TMS5702124DPGEQQ1

Description
16- and 32-Bit RISC Flash Microcontroller 144-LQFP -40 to 125
Categorysemiconductor    The embedded processor and controller   
File Size9MB,167 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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TMS5702124DPGEQQ1 Overview

16- and 32-Bit RISC Flash Microcontroller 144-LQFP -40 to 125

TMS5702124DPGEQQ1 Parametric

Parameter NameAttribute value
Frequency(MHz)160,180
I2C1
CAN(#)3
Approx. price(US$)14.28 | 1ku
CPUArm-Cortex - R4F
Flash (KB)2048
UART(SCI)2
RAM(KB)192
RatingAutomotive
HET channels40,44
ADC2 x 12-Bit (24ch)
SPI1,2
MibSPI3
SCI/LIN2/1
EMIF16-bi
GPIO64,144
Package GrouLQFP|144,NFBGA|337
Data flash(KB)64
Operating temperature range(C)-40 to 125

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Description 16- and 32-Bit RISC Flash Microcontroller 144-LQFP -40 to 125 16- and 32-Bit RISC Flash Microcontroller 337-NFBGA -40 to 125 16- and 32-Bit RISC Flash Microcontroller 337-NFBGA -40 to 125 16- and 32-Bit RISC Flash Microcontroller 144-LQFP -40 to 125 16- and 32-Bit RISC Flash Microcontroller 337-NFBGA -40 to 125 16- and 32-Bit RISC Flash Microcontroller 144-LQFP -40 to 125
Brand Name - Texas Instruments Texas Instruments - Texas Instruments Texas Instruments
Is it Rohs certified? - conform to conform to - conform to conform to
Maker - Texas Instruments Texas Instruments - Texas Instruments Texas Instruments
package instruction - LFBGA, LFBGA, - LFBGA, LFQFP,
Reach Compliance Code - compli compli - compli compli
Factory Lead Time - 6 weeks 20 weeks - 6 weeks 12 weeks
Has ADC - YES YES - YES YES
bit size - 32 32 - 32 32
maximum clock frequency - 80 MHz 80 MHz - 80 MHz 80 MHz
DAC channel - NO NO - NO NO
DMA channel - YES YES - YES YES
JESD-30 code - S-PBGA-B337 S-PBGA-B337 - S-PBGA-B337 S-PQFP-G144
length - 16 mm 16 mm - 16 mm 20 mm
Number of I/O lines - 144 144 - 144 64
Number of terminals - 337 337 - 337 144
On-chip program ROM width - 8 8 - 8 8
Maximum operating temperature - 125 °C 125 °C - 125 °C 125 °C
Minimum operating temperature - -40 °C -40 °C - -40 °C -40 °C
PWM channel - NO NO - NO NO
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - LFBGA LFBGA - LFBGA LFQFP
Package shape - SQUARE SQUARE - SQUARE SQUARE
Package form - GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH - GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
RAM (bytes) - 196608 262144 - 262144 262144
rom(word) - 2097152 2097152 - 3145728 2097152
ROM programmability - FLASH FLASH - FLASH FLASH
Filter level - AEC-Q100 AEC-Q100 - AEC-Q100 AEC-Q100
Maximum seat height - 1.4 mm 1.4 mm - 1.4 mm 1.6 mm
speed - 180 MHz 180 MHz - 180 MHz 160 MHz
Maximum supply voltage - 1.32 V 1.32 V - 1.32 V 1.32 V
Minimum supply voltage - 1.14 V 1.14 V - 1.14 V 1.14 V
Nominal supply voltage - 1.2 V 1.2 V - 1.2 V 1.2 V
surface mount - YES YES - YES YES
technology - CMOS CMOS - CMOS CMOS
Temperature level - AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE
Terminal form - BALL BALL - BALL GULL WING
Terminal pitch - 0.8 mm 0.8 mm - 0.8 mm 0.5 mm
Terminal location - BOTTOM BOTTOM - BOTTOM QUAD
width - 16 mm 16 mm - 16 mm 20 mm
uPs/uCs/peripheral integrated circuit type - MICROCONTROLLER, RISC MICROCONTROLLER, RISC - MICROCONTROLLER, RISC MICROCONTROLLER, RISC
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