MR820........ MR826
5 Amp. Glass Passivated Fast Recovery Rectifier
Dimensions in mm.
P-6
(Plastic)
Voltage
50 to 600 V.
Current
5.0 A. at 55 °C.
®
8.7
± 0.3
59.5
± 1
•
Glass passivated junction
Mounting instructions
1. Min. distance from body to soldering point,
4 mm.
2. Max. solder temperature, 350 °C.
3. Max. soldering time, 3.5 sec.
4. Do not bend lead at a point closer than
4 mm. to the body.
•
Fast Recovery Diodes
•
High current capability
•
The plastic material carries
U/L recognition 94 V-0
•
Terminals: Axial Leads
•
Polarity: Color band denotes cathode
Maximum Ratings, according to IEC publication No. 134
MR820
MR821
100
MR822
200
MR824
400
MR826
600
V
RRM
I
F(AV)
I
FRM
I
FSM
t
rr
T
j
T
stg
E
RSM
Peak recurrent and non recurrent reverse voltage (V)
Forward current at Tamb = 55 °C
Recurrent peak forward current (A)
8.3 ms. peak forward surge current
(Jedec Method)
50
5A
60 A
300 A
150 ns
– 65 to + 175 °C
– 65 to + 175 °C
20 mJ
Max. reverse recovery
time from
I
F
= 0.5 A
I
R
= 1 A
I
RR
= 0.25 A
Operating temperature range
Storage temperature range
Maximum non repetitive peak
reverse avalanche energy.
I
R
= 1A ; T
J
= 25 ºC
Electrical Characteristics at Tamb = 25 °C
V
F
I
R
R
thj-a
Max. forward voltage drop at I
F
= 5 A
Max. reverse current at V
RRM
at 25 °C
Max. thermal resistance (I = 10 mm.)
1.2 V
5µA
10 °C/W
MR820
Rating and Characteristic Curves
TYPICAL FORWARD CHARACTERISTIC
FORWARD CURRENT DERATING CURVE
10mm. - 10mm.
10
5
7
10
4
6
10
3
5
4
10
2
3
T
j
= 25ºC
2
1
10
1
0
0.6
1
1.4
1.8 2.2
2.6
V
F '
instantaneous forward voltage (V)
0
0
25
50
75 100 125 150 175
Tamb, ambient temperature (ºC)
MAXIMUM NON REPETITIVE
PEAK FORWARD SURGE CURRENT
1000
I
FM
400
1 cycle
200
100
40
20
1
2
4
10
20
100
Number of cycles at 60Hz.
Embedded System
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