SM32C6416TBGLZI1EP datasheet, PDF

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SM32C6416TBGLZI1EP: DescriptionEnhanced Product Fixed-Point Digital Signal Processor 532-FCBGA -40 to 105; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，131 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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SM32C6416TBGLZI1EP Overview

Enhanced Product Fixed-Point Digital Signal Processor 532-FCBGA -40 to 105

SM32C6416TBGLZI1EP Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	FCBGA-532
Contacts	532
Reach Compliance Code	not_compliant
ECCN code	3A001.A.3
Factory Lead Time	12 weeks
Address bus width	32
barrel shifter	NO
bit size	32
boundary scan	YES
maximum clock frequency	100 MHz
External data bus width	32
Format	FIXED POINT
Integrated cache	YES
Internal bus architecture	MULTIPLE
JESD-30 code	S-PBGA-B532
JESD-609 code	e0
length	23 mm
low power mode	YES
Humidity sensitivity level	4
Number of DMA channels	64
Number of external interrupt devices	4
Number of terminals	532
Number of timers	3
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HFBGA
Encapsulate equivalent code	BGA532,26X26,32
Package shape	SQUARE
Package form	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
Peak Reflow Temperature (Celsius)	220
power supply	1.2,3.3 V
Certification status	Not Qualified
RAM (number of words)	4096
Maximum seat height	3.25 mm
Maximum supply voltage	1.24 V
Minimum supply voltage	1.16 V
Nominal supply voltage	1.2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	23 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1

SM32C6416TBGLZI1EP Related Products

	SM32C6416TBGLZI1EP	SM32C6416TBGLZA8EP
Description	Enhanced Product Fixed-Point Digital Signal Processor 532-FCBGA -40 to 105	Enhanced Product Fixed-Point Digital Signal Processor 532-FCBGA -40 to 105
Brand Name	Texas Instruments	Texas Instruments
Maker	Texas Instruments	Texas Instruments
Parts packaging code	BGA	BGA
package instruction	FCBGA-532	FCBGA-532
Contacts	532	532
Reach Compliance Code	not_compliant	not_compliant
ECCN code	3A001.A.3	3A001.A.3
Factory Lead Time	12 weeks	6 weeks
Address bus width	32	32
barrel shifter	NO	NO
bit size	32	32
boundary scan	YES	YES
maximum clock frequency	100 MHz	100 MHz
External data bus width	32	32
Format	FIXED POINT	FIXED POINT
Integrated cache	YES	YES
Internal bus architecture	MULTIPLE	MULTIPLE
JESD-30 code	S-PBGA-B532	S-PBGA-B532
JESD-609 code	e0	e0
length	23 mm	23 mm
low power mode	YES	YES
Humidity sensitivity level	4	4
Number of DMA channels	64	64
Number of external interrupt devices	4	4
Number of terminals	532	532
Number of timers	3	3
Maximum operating temperature	105 °C	105 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HFBGA	HFBGA
Encapsulate equivalent code	BGA532,26X26,32	BGA532,26X26,32
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
Peak Reflow Temperature (Celsius)	220	220
power supply	1.2,3.3 V	1.2,3.3 V
Certification status	Not Qualified	Not Qualified
RAM (number of words)	4096	4096
Maximum seat height	3.25 mm	3.25 mm
Maximum supply voltage	1.24 V	1.24 V
Minimum supply voltage	1.16 V	1.16 V
Nominal supply voltage	1.2 V	1.2 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	23 mm	23 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1	1

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