IC,EEPROM,2KX8,CMOS,LDCC,32PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| package instruction | QCCJ, LDCC32,.5X.6 |
| Reach Compliance Code | compli |
| Maximum access time | 250 ns |
| command user interface | NO |
| Data polling | YES |
| JESD-30 code | R-PQCC-J32 |
| JESD-609 code | e3 |
| memory density | 16384 bi |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of terminals | 32 |
| word count | 2048 words |
| character code | 2000 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 2KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC32,.5X.6 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| page size | 32 words |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3/3.3 V |
| Certification status | Not Qualified |
| ready/busy | YES |
| Maximum standby current | 0.00002 A |
| Maximum slew rate | 0.015 mA |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| switch bit | NO |
| Base Number Matches | 1 |
| M28C17-A25WKA6T | M28C17-A30WKA6T | M28C17-A25WNS6 | |
|---|---|---|---|
| Description | IC,EEPROM,2KX8,CMOS,LDCC,32PIN,PLASTIC | IC,EEPROM,2KX8,CMOS,LDCC,32PIN,PLASTIC | IC,EEPROM,2KX8,CMOS,TSSOP,28PIN,PLASTIC |
| Is it lead-free? | Lead free | Lead free | Contains lead |
| Is it Rohs certified? | conform to | conform to | incompatible |
| package instruction | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 | TSSOP, TSSOP28,.53,22 |
| Reach Compliance Code | compli | compli | compli |
| Maximum access time | 250 ns | 300 ns | 250 ns |
| command user interface | NO | NO | NO |
| Data polling | YES | YES | YES |
| JESD-30 code | R-PQCC-J32 | R-PQCC-J32 | R-PDSO-G28 |
| JESD-609 code | e3 | e3 | e0 |
| memory density | 16384 bi | 16384 bi | 16384 bi |
| Memory IC Type | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 |
| Number of terminals | 32 | 32 | 28 |
| word count | 2048 words | 2048 words | 2048 words |
| character code | 2000 | 2000 | 2000 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C |
| organize | 2KX8 | 2KX8 | 2KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | QCCJ | TSSOP |
| Encapsulate equivalent code | LDCC32,.5X.6 | LDCC32,.5X.6 | TSSOP28,.53,22 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| page size | 32 words | 32 words | 32 words |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| ready/busy | YES | YES | YES |
| Maximum standby current | 0.00002 A | 0.00002 A | 0.00002 A |
| Maximum slew rate | 0.015 mA | 0.015 mA | 0.015 mA |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | J BEND | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 0.55 mm |
| Terminal location | QUAD | QUAD | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| switch bit | NO | NO | NO |
| Base Number Matches | 1 | 1 | 1 |
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