DM74LS133N datasheet, PDF - EEWORLD Datasheet

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DM74LS133N: DescriptionNAND Gate, LS Series, 1-Func, 13-Input, TTL, PDIP16, PLASTIC, DIP-16; Categorylogic logic; File Size133KB，6 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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DM74LS133N Overview

NAND Gate, LS Series, 1-Func, 13-Input, TTL, PDIP16, PLASTIC, DIP-16

DM74LS133N Parametric

Parameter Name	Attribute value
Maker	Rochester Electronics
package instruction	PLASTIC, DIP-16
Reach Compliance Code	unknown
series	LS
JESD-30 code	R-PDIP-T16
length	19.305 mm
Logic integrated circuit type	NAND GATE
Number of functions	1
Number of entries	13
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
propagation delay (tpd)	38 ns
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm

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DM74LS133N Related Products

	DM74LS133N	DM74LS133M	DM54LS133W	DM54LS133E
Description	NAND Gate, LS Series, 1-Func, 13-Input, TTL, PDIP16, PLASTIC, DIP-16	NAND Gate, LS Series, 1-Func, 13-Input, TTL, PDSO16, PLASTIC, SOP-16	NAND Gate, LS Series, 1-Func, 13-Input, TTL, CDFP16, CERAMIC, FP-16	NAND Gate, LS Series, 1-Func, 13-Input, TTL, CQCC20, CERAMIC, LCC-20
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
package instruction	PLASTIC, DIP-16	PLASTIC, SOP-16	DFP,	QCCN,
Reach Compliance Code	unknown	unknown	unknown	unknown
series	LS	LS	LS	LS
JESD-30 code	R-PDIP-T16	R-PDSO-G16	R-GDFP-F16	S-CQCC-N20
length	19.305 mm	9.9 mm	9.6645 mm	8.89 mm
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	NAND GATE
Number of functions	1	1	1	1
Number of entries	13	13	13	13
Number of terminals	16	16	16	20
Maximum operating temperature	70 °C	70 °C	125 °C	125 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	SOP	DFP	QCCN
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
Package form	IN-LINE	SMALL OUTLINE	FLATPACK	CHIP CARRIER
propagation delay (tpd)	38 ns	38 ns	38 ns	38 ns
Maximum seat height	5.08 mm	1.75 mm	2.032 mm	1.905 mm
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES
technology	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	GULL WING	FLAT	NO LEAD
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	QUAD
width	7.62 mm	3.9 mm	6.604 mm	8.89 mm

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