LS SERIES, 13-INPUT NAND GATE, PDIP16, PLASTIC, DIP-16
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| series | LS |
| JESD-30 code | R-PDIP-T16 |
| JESD-609 code | e0 |
| length | 19.305 mm |
| Load capacitance (CL) | 15 pF |
| Logic integrated circuit type | NAND GATE |
| MaximumI(ol) | 0.008 A |
| Number of functions | 1 |
| Number of entries | 13 |
| Number of terminals | 16 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Maximum supply current (ICC) | 1.1 mA |
| Prop。Delay @ Nom-Sup | 38 ns |
| propagation delay (tpd) | 38 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| DM74LS133N | DM74LS133M | DM54LS133W | DM54LS133J | DM54LS133E | |
|---|---|---|---|---|---|
| Description | LS SERIES, 13-INPUT NAND GATE, PDIP16, PLASTIC, DIP-16 | LS SERIES, 13-INPUT NAND GATE, PDSO16, PLASTIC, SOP-16 | LS SERIES, 13-INPUT NAND GATE, CDFP16, CERAMIC, FP-16 | LS SERIES, 13-INPUT NAND GATE, CDIP16, CERAMIC, DIP-16 | LS SERIES, 13-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP16,.3 | SOP, SOP16,.25 | DFP, FL16,.3 | DIP, DIP16,.3 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| series | LS | LS | LS | LS | LS |
| JESD-30 code | R-PDIP-T16 | R-PDSO-G16 | R-GDFP-F16 | R-GDIP-T16 | S-CQCC-N20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| length | 19.305 mm | 9.9 mm | 9.6645 mm | 19.43 mm | 8.89 mm |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| MaximumI(ol) | 0.008 A | 0.008 A | 0.004 A | 0.004 A | 0.004 A |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of entries | 13 | 13 | 13 | 13 | 13 |
| Number of terminals | 16 | 16 | 16 | 16 | 20 |
| Maximum operating temperature | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | - | -55 °C | -55 °C | -55 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | SOP | DFP | DIP | QCCN |
| Encapsulate equivalent code | DIP16,.3 | SOP16,.25 | FL16,.3 | DIP16,.3 | LCC20,.35SQ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | IN-LINE | SMALL OUTLINE | FLATPACK | IN-LINE | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum supply current (ICC) | 1.1 mA | 1.1 mA | 1.1 mA | 1.1 mA | 1.1 mA |
| Prop。Delay @ Nom-Sup | 38 ns | 38 ns | 38 ns | 38 ns | 38 ns |
| propagation delay (tpd) | 38 ns | 38 ns | 38 ns | 38 ns | 38 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO | NO |
| Maximum seat height | 5.08 mm | 1.75 mm | 2.032 mm | 5.08 mm | 1.905 mm |
| Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | NO | YES |
| technology | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING | FLAT | THROUGH-HOLE | NO LEAD |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 3.9 mm | 6.604 mm | 7.62 mm | 8.89 mm |
| Maker | Texas Instruments | - | - | Texas Instruments | Texas Instruments |