F-219 (Rev 15AUG19)
HSEC8–125–01–L–DV–A
HSEC8–149–01–L–DV–A
(0.80 mm) .0315"
HSEC8-DV SERIES
VERTICAL EDGE RATE CARD SOCKET
®
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?HSEC8-DV
Insulator Material:
Black Liquid Crystal Polymer
Contact:
BeCu
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
2.8 A per pin
(2 adjacent pins powered)
Operating Temp:
-55 °C to +125 °C
RoHS Compliant:
Yes
Card Mates:
(1.60 mm) .062" card,
(2.36 mm) .093" card,
HSC8
Cable Mates:
ECDP
Mates with (1.60 mm) .062"
or (2.36 mm) .093" cards
MISALIGNMENT
MITIGATION
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 30 µ" GOLD
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (10-60)
HIGH-SPEED CHANNEL PERFORMANCE
HSEC8-DV
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
28
G b p s
Custom designs compensate for misalignment.
HSEC8
1
POSITIONS
PER ROW
CARD
THICKNESS
PLATING
OPTION
DV
A
OTHER
OPTION
FILE NO. E111594
CABLE CONNECTOR
ECDP–04
ECDP–08
ECDP–16
ECDP–32
HSEC8–109–L2
HSEC8–113–L2
HSEC8–125–L2
HSEC8–149–L2
(13, 25, 49 only available
with –L or –L2 option;
09 only available with –L2 option;
37 only available with –L option)
02
09, 10, 13, 20,
25, 30, 37, 40, 49,
50, 60, 70, 80, 100
= (1.60 mm) .062"
thick card
–01
–03
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
–L
= (2.36 mm) .093"
thick card
= 30 µ" (0.76 µm)
Gold on contact,
Matte Tin on tail
–S
= (7.01 mm) .276" DIA Polyimide Film
Pick & Place Pad; with –01 card,
= (6.25 mm) .246" DIA Polyimide Film
Pick & Place Pad; with –03 card
= Board Locks –01 card only
(Weld tab standard)
= Latching Option; –01 card only
(13, 25, 37, 49 only)
(Weld tab standard)
= ECDP Latching; –01 card only
(09, 13, 25, 49 only)
(For use with ECDP)
(Weld tab standard)
= Weld tab
–K
–BL
–L
No. of Positions x (0.80) .0315 + (7.80) .307
(7.00)
.276
POSITIONS
PER ROW
09*
†
13*
†
25*
†
37
†
40
49*
†
50
60
70
†
80
†
100
†
A
B
(4.50) .177 (11.80) .465
(6.10) .240 (15.00) .591
(6.10) .240 (24.60) .969
(18.10) .713 (34.20) 1.346
(18.90) .744 (36.60) 1.441
(22.90) .902 (43.80) 1.724
(22.90) .902 (44.60) 1.756
(26.90) 1.059 (52.60) 2.071
(26.90) 1.059 (60.60) 2.386
(26.90) 1.059 (68.60) 2.701
(26.90) 1.059 (84.60) 3.331
Positions where no dimensions are given
do not have keying feature.
* Mates with ECDP Series.
† Available with –01 Card Only.
01
A
B
(1.75)
.070
–L2
(7.80) (7.98)
.307 .314
–WT
–TR
–FR
(No. of Positions + 6) x (0.80) .0315 + (0.60) .024
09, 13, 25, 37, 100
No. of Positions
x (0.80) .0315 + (4.60) .181
(1.32)
.052
Notes:
While optimized for 50
W
applications, this connector
with alternative signal/ground
patterns may also perform well
in certain 75
W
applications.
Some lengths, styles and
options are non-standard,
non-returnable.
= Tape & Reel
(09 - 70 only)
= Full Reel Tape & Reel Packaging
(Must order max. quantities per reel.
Contact Samtec for parts per reel)
(09 - 70 only)
02
(5.60)
.220
01
(0.80) .0315
(1.12) .044 DIA
No. of Positions x (0.80) .0315 + (2.20) .087
10, 20 & 30
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
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Analog electronics
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